s71pl127n Meet Spansion Inc., s71pl127n Datasheet - Page 8

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s71pl127n

Manufacturer Part Number
s71pl127n
Description
Stacked Multi-chip Product Mcp 128 Megabit 8 M ? 16-bit Cmos 3.0 Volt-only Simultaneous Read/write, Page Mode Flash Memory With 64/32 Megabit 4/2 M ? 16-bit Psram
Manufacturer
Meet Spansion Inc.
Datasheet

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6
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
φb
A
D
E
n
CORNER
0.15 C
(2X)
PIN A1
A2
A1
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
MIN
0.17
0.81
0.35
A2,A3,A4,A5,A6,A7,A8,A9
---
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
84X
11.60 mm x 8.00 mm
INDEX MARK
0.15
0.08
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC
0.80 BSC
0.40 BSC
TSB 084
10
6
b
NOM
0.40
N/A
M C
M C
---
---
---
12
10
84
A B
MAX
1.20
0.97
0.45
SIDE VIEW
TOP VIEW
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71PL-N MirrorBit
Figure 5.2 TSB084 Physical Dimensions
NOTE
D a t a
C
A
0.15
(2X)
E
B
TM
C
MCPs
0.20
0.08
S h e e t
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
S71PL-N_00_A9 December 8, 2006
H
G
D1
F
E
D
C
B
A
3439 \ 16-038.22 \ 01.04.05
SE
CORNER
PIN A1
7
E1

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