hi-3182ps Holt Integrated Circuits, Inc., hi-3182ps Datasheet - Page 5

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hi-3182ps

Manufacturer Part Number
hi-3182ps
Description
Arinc 429 Differential Line Driver
Manufacturer
Holt Integrated Circuits, Inc.
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
hi-3182psI
Manufacturer:
MAXIM
Quantity:
400
HEAT SINK - ESOIC PACKAGES
Both the 14-pin and 16-pin thermally enhanced SOIC
packages are used for HI-318X products. These ESOIC
packages include a metal heat sink located on the bottom
surface of the device. This heat sink should be soldered
down to the printed circuit board for optimum thermal
HI-318X PACKAGE THERMAL CHARACTERISTICS
Notes:
1. All data taken
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
4. Similar results would be obtained with A
5. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
6. Data will vary depending on air flow and the method of heat sinking employed.
7. Current values listed are for each of the +V and -V supplies.
PACKAGE STYLE
PACKAGE STYLE
Enhanced Plastic
Enhanced Plastic
Enhanced Plastic
Enhanced Plastic
14-pin Thermally
14-pin Thermally
14-pin Thermally
14-pin Thermally
as this is considered unrealistic for high speed operation.
SOIC (ESOIC)
SOIC (ESOIC)
28-pin Plastic
SOIC (ESOIC)
SOIC (ESOIC)
28-pin Plastic
in still air
1
1
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
HEAT SINK
Unsoldered
Unsoldered
HEAT SINK
Unsoldered
Unsoldered
Soldered
Soldered
Soldered
Soldered
A
N/A
N/A
OUT
and B
MAXIMUM ARINC LOAD
HOLT INTEGRATED CIRCUITS
(°C/W)
OUT
(°C/W)
ØJA
ØJA
OUT
82
65
51
28
70
82
65
51
28
70
shorted to B
Shorted to Ground
SUPPLY CURRENT
SUPPLY CURRENT
5
dissipation. The heat sink is electrically isolated from the
chip and can be soldered to any ground or power plane.
However, since the chip’s substrate is at +V, connecting
the heat sink to this power plane is recommended to avoid
coupling noise into the circuit.
OUT
20 mA
20 mA
20 mA
20 mA
25 mA
36 mA
36 mA
40 mA
40 mA
63 mA
.
3, 6, 7
2
3, 4, 5, 6, 7
2
TA = 25°C TA = 85°C TA = 125°C
TA = 25°C TA = 85°C TA = 125°C
JUNCTION TEMPERATURE, Tj
JUNCTION TEMPERATURE, Tj
100°C
57°C
51°C
45°C
36°C
56°C
57°C
78°C
64°C
53°C
105°C
117°C
110°C
147°C
138°C
124°C
150°C
111°C
113°C
96°C
157°C
151°C
145°C
136°C
150°C
187°C
178°C
164°C
153°C
182°C

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