hx6136 Honeywell International's Solid State Electronics Center (SSEC), hx6136 Datasheet - Page 14

• Manufacturer Part Number: hx6136
• Description: First-in First-out Memory
• Manufacturer: Honeywell International's Solid State Electronics Center (SSEC)

Package Drawing For 6409 (22020651-001)
FIFO – HX6409/HX6218/HX6136
PACKAGING
The FIFO is offered in a 32-lead, 68-lead and a 132-
lead flat pack, depending on the configuration. These
packages are constructed of multilayer ceramic (Al2O3)
and features internal power and ground planes. The flat
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Package Drawing For 6218 (22019075-001)
packs also feature non-conductive ceramic tie bars.
The tie bars allows electrical testing of the device, while
preserving the lead integrity during shipping and
handling, up to the point of lead forming and insertion.
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