km29w32000ts Samsung Semiconductor, Inc., km29w32000ts Datasheet - Page 8

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km29w32000ts

Manufacturer Part Number
km29w32000ts
Description
8-bit Nand Flash Memory
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
AC Timing Characteristics for Command / Address / Data Input
AC Characteristics for Operation
NOTE : 1. If CE goes high within 30ns after the rising edge of the last RE, R/B will not return to V
KM29W32000TS
CLE Set-up Time
CLE Hold Time
CE Setup Time
CE Hold Time
WE Pulse Width
ALE Setup Time
ALE Hold Time
Data Setup Time
Data Hold Time
Write Cycle Time
WE High Hold Time
Data Transfer from Cell to Register
ALE to RE Delay(read ID)
ALE to RE Delay(Read cycle)
CE to RE Delay(ID read)
Ready to RE Low
RE Pulse Width
WE High to Busy
Read Cycle Time
RE Access Time
RE High to Output Hi-Z
CE High to Output Hi-Z
RE High Hold Time
Output Hi-Z to RE Low
Last RE High to Busy(at sequential read)
CE High to Ready(in case of interception by CE at read)
CE High Hold Time(at the last serial read)
RE Low to Status Output
CE Low to Status Output
RE High to WE Low
WE High to RE Low
Erase Suspend Input to Ready
RE access time(Read ID)
Device Resetting Time
2. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
3. To break the sequential read cycle, CE must be held high for longer time than t
Parameter
(Read/Program/Erase/after erase suspend)
Parameter
(3)
Symbol
t
t
t
t
(1)
t
t
t
t
t
t
t
CLH
CLS
ALS
ALH
WP
WC
WH
CH
DH
CS
DS
8
Symbol
t
READID
t
t
t
t
t
t
t
t
t
t
t
t
RSTO
CSTO
t
t
RHW
WHR
t
t
t
t
REH
t
CRY
CEH
t
AR1
AR2
REA
RHZ
CHZ
RST
t
t
CR
RR
RP
WB
RC
RB
SR
IR
R
CEH
Min
10
10
25
10
20
10
50
15
0
0
0
.
OL
Min
150
100
100
.
50
20
30
50
15
15
60
0
0
-
-
-
-
-
-
-
-
-
-
-
FLASH MEMORY
Max
50 +tr(R/B)
5/10/500/5
-
-
-
-
-
-
-
-
-
-
-
Max
100
100
500
10
35
30
20
35
45
35
-
-
-
-
-
-
-
-
-
-
-
(2)
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
s

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