MSA-0500-GP4 HP [Agilent(Hewlett-Packard)], MSA-0500-GP4 Datasheet

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MSA-0500-GP4

Manufacturer Part Number
MSA-0500-GP4
Description
Cascadable Silicon Bipolar MMIC Amplifier
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
5965-9579E
Cascadable Silicon Bipolar
MMIC Amplifier
Technical Data
Features
• Cascadable 50
• High Output Power:
• Low Distortion:
• 8.5 dB Typical Gain at
Description
The MSA-0500 is a high perfor-
mance, medium power silicon
bipolar Monolithic Microwave
Integrated Circuit (MMIC) chip.
This MMIC is designed for use as a
general purpose 50
Typical applications include
narrow and broad band IF and RF
amplifiers in industrial and
military systems.
Typical Biasing Configuration
IN
+23 dBm Typical P
1.0 GHz
33 dBm Typical IP
1.0 GHz
C
block
1
4
MSA
2
C
3
Fbl
3
Gain Block
1 dB
at 1.0 GHz
gain block.
V
d
at
= 12 V
RFC (Optional)
R
C
bias
block
(Required)
The MSA-series is fabricated using
HP’s 10 GHz f
silicon bipolar MMIC process
which uses nitride self-alignment,
ion implantation, and gold metalli-
zation to achieve excellent
performance, uniformity and
reliability. The use of an external
bias resistor for temperature and
current stability also allows bias
flexibility.
The recommended assembly
procedure is gold-eutectic die
attach at 400 C and either wedge
or ball bonding using 0.7 mil gold
wire.
This chip is intended to be used
with an external blocking capaci-
tor completing the shunt feedback
path (closed loop). Data sheet
characterization is given for a
V
OUT
CC
> 15 V
T
, 25 GHz f
6-346
MAX
,
MSA-0500
Chip Outline
45 pF capacitor. Low frequency
performance can be extended by
using a larger valued capacitor.
Note:
1. See Application Note, AN-S009:
3
“Silicon MMIC Chip Use” for
additional information.
5
4
1
[1]
2
2
[1]

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MSA-0500-GP4 Summary of contents

Page 1

... Low Distortion: 33 dBm Typical IP at 1.0 GHz 3 • 8.5 dB Typical Gain at 1.0 GHz Description The MSA-0500 is a high perfor- mance, medium power silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) chip. This MMIC is designed for use as a general purpose 50 gain block. Typical applications include ...

Page 2

... [ 165 mA 1.0 GHz f = 0.1 GHz f = 0.1 to 2.0 GHz f = 0.1 to 2.0 GHz f = 0.1 to 2.0 GHz f = 1.0 GHz f = 1.0 GHz f = 1.0 GHz Part Number Ordering Information Part Number Ground MSA-0500-GP4 Output Trace (backside 3 contact) Ground 6-347 [2,4] Thermal Resistance : = 20 C/W jc Units Min. Typ. Max. dBm 23.0 dB 9.0 dB ...

Page 3

... MSA-0500 Typical Scattering Parameters S 11 Freq. GHz Mag Ang 0.001 .68 –8 0.005 .57 –38 14.6 0.010 .43 –65 12.8 0.050 .16 –111 0.100 .12 –134 0.200 .12 –141 0.400 .13 –133 0.600 .16 –124 0.800 .21 –118 1.00 .25 –115 1.50 .36 –113 2.00 .45 –120 2.50 .51 –125 3.00 .52 –134 3.50 .51 –144 4.00 .46 –157 Notes: 1. S-parameters are de-embedded from 200 mil BeO package measured data using the package model found in the DEVICE MODELS section ...

Page 4

... MSA-0500 Chip Dimensions 530 m 20.8 mil Unless otherwise specified, tolerances are 13 m/ 0.5 mils. Chip thickness is 114 m/4.5 mil. Bond Pads are 41 m/1.6 mil typical on each side. Note 1: Output contact is made by die attaching the backside of the die. [1] 570 m 22.4 mil 6-349 ...

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