IRG4BC40FD IRF [International Rectifier], IRG4BC40FD Datasheet - Page 25

• Manufacturer Part Number: IRG4BC40FD
• Description: Fit Rate / Equivalent Device Hours
• Manufacturer: IRF [International Rectifier]

IGBT / CoPack
Quarterly Reliability Report
Conditions
Bias:
Temperature:
Duration:
Test points:
Purpose
Failure Modes
Sensitive Parameters
Vge = As required
Tmax
2000 Hours nominal
168, 500, 1000,
1500, 2000 Hours nominal.
The primary failure modes for long term gate stress is a rupture of the gate oxide,
causing either a resistive short between gate-to-emitter or gate-to-collector or what
appears to be a low breakdown diode between the gate and source.
The oxide breakdown has been attributed to the degradation in time of existing
defects in the thermally grown oxide. These defects can take form of localized
thickness variations, structural anomalies or the presence of sub-micron
particulate, within the oxide.
As with HTRB, extreme care must be exercised in the course of a long term test to
avoid potential hazards such as electrostatic discharge or electrical overstress to
the gate during test. Failures arising from this abuse are virtually indistinguishable
from true oxide breakdown which result from the actual stress test.
The purpose of High Temperature Gate Bias is to stress the devices with the
applied bias to the gate while at elevated junction temperature to accelerate time
dependent dielectric breakdown of the gate structure.
HIGH TEMPERATURE GATE BIAS (HTGB)
I
CES,
V
GE(th)
DUT
D = Diode for CoPack devices only
Test circuit
D
BIAS
DC
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