SI5013-X-GM ETC1 [List of Unclassifed Manufacturers], SI5013-X-GM Datasheet - Page 18

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SI5013-X-GM

Manufacturer Part Number
SI5013-X-GM
Description
OC-12/3, STM-4/1 SONET/SDH CDR IC WITH LIMITING AMPLIFIER
Manufacturer
ETC1 [List of Unclassifed Manufacturers]
Datasheet
Si5013
5. Pin Descriptions: Si5013
18
Pin #
1
3
4
5
6
SLICE_LVL
Pin Name
REFCLK+
RATESEL
REFCLK–
LOS_LVL
Figure 15. Si5013 Pin Configuration
SLICE_LVL
I/O
Table 8. Si5013 Pin Descriptions
RATESEL
REFCLK+
REFCLK–
LOS_LVL
I
I
I
I
GND
LOL
1
2
3
4
5
6
7
Signal Level
See Table 2
28 27 26 25 24 23 22
8
LVTTL
9
Rev. 1.4
10 11 12 13 14
GND
Pad
Data Rate Select.
This pin configures the onboard PLL for clock and
data recovery at one of two user selectable data
rates. See Table 7 for configuration settings.
Note: This input has a weak internal pullup.
LOS Level Control.
The LOS threshold is set by the input voltage level
applied to this pin. Figure 6 on page 13 shows the
input setting to output threshold mapping.
LOS is disabled when the voltage applied is less
than 1 V.
Slicing Level Control.
The slicing threshold level is set by applying a volt-
age to this pin as described in the Slicing Level sec-
tion of the data sheet. If this pin is tied to GND,
slicing level adjustment is disabled, and the slicing
level is set to the midpoint of the differential input
signal on DIN. Slicing level becomes active when
the voltage applied to the pin is greater than
500 mV.
Differential Reference Clock (Optional).
When present, the reference clock sets the center
operating frequency of the DSPLL for clock and
data recovery. Tie REFCLK+ to VDD and REFCLK–
to GND to operate without an external reference
clock.
See Table 7 on page 12 for typical reference clock
frequencies.
21
20
19
18
17
16
15 TDI
VDD
REXT
RESET/CAL
VDD
DOUT+
DOUT–
Description

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