AD7816-7818 Analog Devices, AD7816-7818 Datasheet - Page 6

• Manufacturer Part Number: AD7816-7818
• Description: Single- and 4-Channel/ 9 us/ 10-Bit ADCs with On-Chip Temperature Sensor
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
(
V
V
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND . . . . . . –0.3 V to V
Digital Output Voltage to DGND . . . . . –0.3 V to V
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
8-Lead SOIC Package, Power Dissipation . . . . . . . . . 450 mW
AD7816/AD7817/AD7818
Model
AD7816AR
AD7816ARM
AD7817AR
AD7817BR
AD7817ARU
AD7817BRU
AD7817SR
AD7818AR
AD7818ARM
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7816/AD7817/AD7818 feature proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
T
DD
DD
A
V
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
JA
= +25 C unless otherwise noted)
IN1
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157 C/W
to V
IN4
. . . . . . . . . . . . . . . . . . . –0.3 V to V
Temperature
Range
–55 C to +125 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–55 C to +125 C
–55 C to +125 C
2
1
. . . –0.3 V to V
Temperature
Error @ +25 C
2 C
2 C
2 C
1 C
2 C
1 C
2 C
2 C
2 C
DD
DD
DD
DD
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Package
Description
8-Lead Narrow Body (SOIC)
8-Lead SOIC
16-Lead Narrow Body (SOIC)
16-Lead Narrow Body (SOIC)
16-Lead (TSSOP)
16-Lead (TSSOP)
16-Lead Narrow Body (SOIC)
8-Lead Narrow Body (SOIC)
8-Lead SOIC
–6–
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
If the Reference Input Voltage is likely to exceed V
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
diagram below shows how the diode should be connected.
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
Lead Temperature, Soldering
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206 C/W
AD7816/AD7817
REF
IN
Branding
Information
C4A
C3A
BAT81
WARNING!
V
DD
DD
by more than 0.3 V (e.g.,
ESD SENSITIVE DEVICE
IN
pin and V
Package
Options
SO-8
RM-8
R-16A
R-16A
RU-16
RU-16
R-16A
SO-8
RM-8
DD
REV. A
pin. The