AD9058KD AD [Analog Devices], AD9058KD Datasheet - Page 8

• Manufacturer Part Number: AD9058KD
• Description: Dual 8-Bit 50 MSPS A/D Converter
• Manufacturer: AD [Analog Devices]

AD9058
Die Dimensions . . . . . . . . . . . . . . . . 106 × 108 × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic)
Bond Wire . . . . . . . . . . . . 1–1.3 mil, Gold; Gold Ball Bonding
0.020 TYP
0.050 TYP
(0.508)
(1.27)
44-Lead J-Leaded Ceramic (J-44) Package
17
7
18
6
0.690 ± 0.012 SQ.
0.650 ±0.008 SQ.
(16.51 ±0.203)
(12.70 ± 0.203)
0.630 ± 0.020
(16.0 ± 0.058)
(17.5 ± 0.305)
0.500 ±0.008
0.017 (0.432)
PIN 1
TYP
40
28
(0.940 ± 0.305)
0.037 ± 0.012
MECHANICAL INFORMATION
39
29
Dimensions shown in inches and (mm).
OUTLINE DIMENSIONS
0.135 (3.42)
MAX
S
(5.72 MAX)
0.225 MAX
0.023 (0.58)
0.014 (0.36)
48
1
48-Lead Hermetic Ceramic DIP (D-48) Package
0.110 (2,79)
0.090 (2.29)
(60.96 ± 0.609)
2.400 ± 0.024
0.62 (15.75)
0.59 (12.95)
0.63 (16.00)
0.52 (13.21)
(1.77 MAX)
0.70 MAX
0.015 (0.38)
0.008 (0.20)
25
24
0.060 (1.52)
0.015 (0.38)
(3.81)
0.150
MIN