AD5062BRJ-1 AD [Analog Devices], AD5062BRJ-1 Datasheet - Page 16

• Manufacturer Part Number: AD5062BRJ-1
• Description: Full Accurate 16 Bit Vout nanoDac, 2.7V- 5.5V, in a Sot 23
• Manufacturer: AD [Analog Devices]

AD5062/AD5063
Figure 31. The power supply to the part also needs to be
isolated. This is done by using a transformer. On the DAC side
of the transformer, a +5 V regulator provides the +5 V supply
required for the AD5062/AD5063.
Power Supply Bypassing and Grounding
When accuracy is important in a circuit it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the
AD5062/AD5063 should have separate analog and digital
sections, each having its own area of the board. If the
AD5062/AD5063 is in a system where other devices require an
SCLK
SDI
DATA
Figure 31. AD5062/AD5063 with An Opto-Isolated Interface
POWER
V1A
V1B
V1C
ADMu103x
VOB
VOA
VOC
REGULATOR
+5V
SCLK
SDI
DIN
DAC
GND
V
DD
10. F
V
OUT
0.1. F
Rev. Pr B | Page 16 of 17
AGND to DGND connection, the connection should be
made at one point only. This ground point should be
as close as possible to the AD5062/AD5063.
The power supply to the AD5062/AD5063 should be
bypassed with
10 µF and 0.1 µF capacitors. The capacitors should be
physically as close as possible to the device with the 0.1 µF
capacitor ideally right up against the device. The 10 µF
capacitors are the tantalum bead type. It is important that the
0.1 µF capacitor has low Effective Series Resistance (ESR) and
Effective Series Inductance (ESI), e.g., common ceramic types
of capacitors. This 0.1 µF capacitor provides a low impedance
path to ground for high frequencies caused by transient
currents due to internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of
the board by digital ground. Avoid crossover of digital and
analog signals if possible. When traces cross on opposite sides
of the board, ensure that they run at right angles to each other
to reduce feedthrough effects through the board. The best
board layout technique is the microstrip technique where the
component side of the board is dedicated to the ground plane
only and the signal traces are placed on the solder side.
However, this is not always possible with a two-layer board.
Preliminary Technical Data