DSP56800FMD MOTOROLA [Motorola, Inc], DSP56800FMD Datasheet

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DSP56800FMD

Manufacturer Part Number
DSP56800FMD
Description
Preliminary Technical Data DSP56F826 16-bit Digital Signal Processor
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
© Motorola, Inc., 2001. All rights reserved.
Preliminary Technical Data
DSP56F826 16-bit Digital Signal Processor
4
6
4
4
16
Up to 40 MIPS at 80MHz core frequency
DSP and MCU functionality in a unified,
C-efficient architecture
Hardware DO and REP loops
MCU-friendly instruction set supports both
DSP and controller functions: MAC, bit
manipulation unit, 14 addressing modes
31.5K
512
2K
4K
2K
SCI0 & SCI1
Semiconductor Products Sector
Dedicated
Quad Timer
GPIO
GPIO
SPI0
GPIO
SPI1
SSI
GPIO
or
or
or
or
16-bit words Data Flash
16-bit words Data RAM
16-bit words BootFLASH
16-bit words Program RAM
16-bit words Program Flash
Application-
Peripherals
Program Memory
32252 x 16 Flash
4096 x 16 SRAM
Memory &
2048 x 16 Flash
2048 x 16 Flash
512 x 16 SRAM
Specific
Data Memory
Boot Flash
Controller
Interrupt
Timer
TOD
Watchdog
COP/
Figure 1. DSP56F826 Block Diagram
Hardware Looping Unit
RESET
MODULE CONTROLS
Program Controller
ADDRESS BUS [8:0]
RESET
DATA BUS [15:0]
COP
IRQA
and
IRQB
EXTBOOT
CGDB
XAB1
XAB2
XDB2
PAB
PDB
INTERRUPT
CONTROLS
6
JTAG/
OnCE
Port
Generation
Address
Unit
IPBus Bridge
16
3
V
(IPBB)
DD
Low Voltage Supervisor
CONTROLS
Up to 64K
memory expansion for Program and Data
memory
One Serial Port Interface (SPI)
One additional SPI or two optional Serial
Communication Interfaces (SCI)
One Synchronous Serial Interface (SSI)
One General Purpose Quad Timer
JTAG/OnCE
100-pin LQFP Package
16 dedicated and 30 shared GPIO
One Time-of-Day module
IPBB
3
V
Three 16-bit Input Registers
16 x 16 + 36
SS
Two 36-bit Accumulators
4
16
V
IO
DD
Data ALU
DSP56800
4
16-Bit
Core
V
36-Bit MAC
IO
16-bit words each of external
Interface
SS
External
Unit
Bus
for debugging
DSP56F826
Analog Reg
V
DDA
Manipulation
Address Bus
Clock Gen
V
Data Bus
External
External
Control
SSA
Switch
Switch
PLL
Bus
Unit
Bit
.
Rev. # 0, 3/2001
DSP56F826/D
16
16
CLKO
A[00:15]
or
GPIO
D[00:15]
PS Select
DS Select
WR Enable
RD Enable
XTAL
EXTAL

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DSP56800FMD Summary of contents

Page 1

Semiconductor Products Sector Preliminary Technical Data DSP56F826 16-bit Digital Signal Processor • MIPS at 80MHz core frequency • DSP and MCU functionality in a unified, C-efficient architecture • Hardware DO and REP loops • MCU-friendly instruction set ...

Page 2

Part 1 Overview 1.1 DSP56F826 Features 1.1.1 Digital Signal Processing Core • Efficient 16-bit DSP56800 Family DSP engine with dual Harvard architecture • As many as 40 Million Instructions Per Second (MIPS) at 80MHz core frequency • Single-cycle 16 16-bit ...

Page 3

Sixteen (16) dedicated general purpose I/O (GPIO) pins • Thirty (30) shared general purpose I/O (GPIO) pins • Computer-Operating Properly (COP) Watchdog timer • Two external interrupt pins • External reset pin for hardware reset • JTAG/On-Chip Emulation (OnCE™) ...

Page 4

Best in Class Development Environment The SDK (Software Development Kit) provides fully debugged peripheral drivers, libraries and interfaces that allow programmers to create their unique C application code independent of component architecture. The CodeWarrior Integrated Development Environment is a ...

Page 5

Part 2 Signal/Connection Descriptions 2.1 Introduction The input and output signals of the DSP56F826 are organized into functional groups, as shown in and as illustrated in Figure 2. In Table 2. Functional Group Pin Allocations Power ( ...

Page 6

Power Port Ground Port DDIO 3.3V Power Port 4 V Ground Port SSIO V Analog Power Port (3.3V) DDA Ground Port V SSA ) EXTAL(CLOCKIN PLL and Clock XTAL CLKO External ...

Page 7

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 8

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 9

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 10

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 11

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 12

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 13

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 14

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 15

Table 3. DSP56F826 Signal and Package Information for the 100 Pin LQFP All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always enabled. Exceptions: 1. When owned by GPIO, then the ...

Page 16

Part 3 Specifications 3.1 General Characteristics The DSP56F826 is fabricated in high-density CMOS with 5-volt tolerant TTL-compatible digital inputs. The term 5-volt tolerant refers to the capability of an I/O pin, built on a 3.3V compatible process technology, to withstand ...

Page 17

Table 5. Recommended Operating Conditions Characteristic Supply voltage, core Supply Voltage, IO and analog Ambient operating temperature Flash program/erase temperature Table 6. Thermal Characteristics Characteristic Thermal resistance junction-to-ambient (estimated) I/O pin power dissipation Power dissipation Maximum allowed ...

Page 18

Table 7. DC Electrical Characteristics (Continued) Operating Conditions SSIO SS SSA Characteristic Output tri-state current high Output High Voltage with IOH load Output Low Voltage with IOL load Output High Current Output Low Current Input capacitance ...

Page 19

AC Electrical Characteristics Timing waveforms in Section 3.3 all pins except XTAL, which is tested using the input levels in V for an input signal are shown Input Signal Midpoint1 Fall Time Note: The midpoint is V ...

Page 20

Flash Memory Characteristics Table 8. Flash Memory Truth Table 1 Mode XE Standby L Read H Word Program H Page Erase H Mass Erase address enable, all rows are disabled when ...

Page 21

Table 10. Timing Symbols Characteristic X address access time Y address access time OE access time PROG/ERASE to NVSTR set up time NVSTR hold time NVSTR hold time(mass erase) NVSTR to program set up time Program hold time Address/data set ...

Page 22

Table 11. Flash Timing Parameters Operating Conditions SSIO SS SSA Characteristic 1 Program time 2 Erase time 3 Mass erase time 4 Endurance Data Retention The following parameters should only be used in the Manual Word ...

Page 23

IFREN XADR XE YADR YE DIN PROG Tnvs NVSTR Tpgs Figure 5. Flash Program Cycle IFREN XADR XE YE=SE=OE=MAS1=0 ERASE Tnvs NVSTR DSP56F826 Preliminary Technical Data Tadh Tads Tprog Thv Terase Figure 6. Flash Erase Cycle Flash Memory Characteristics Tpgh ...

Page 24

IFREN XADR XE MAS1 YE=SE=OE=0 ERASE Tnvs NVSTR Figure 7. Flash Mass Erase Cycle 3.5 External Clock Operation The DSP56F826 system clock can be derived from a crystal or an external system clock signal. To generate a reference frequency using ...

Page 25

EXTAL XTAL Figure 8. External Crystal Oscillator Circuit 3.5.2 External Clock Source The recommended method of connecting an external clock is given in is connected to XTAL and the EXTAL pin is grounded. Figure 9. Connecting an External Clock Signal ...

Page 26

Table 12. External Clock Operation Timing Requirements Operating Conditions SSIO SS SSA Characteristic Frequency of operation (external clock driver Clock Pulse Width 3, 5 External clock input rise time 4, 5 External clock input ...

Page 27

External Bus Asynchronous Timing Table 14. External Bus Asynchronous Timing Operating Conditions SSIO SS SSA Characteristic Address Valid to WR Asserted WR Width Asserted Wait states = 0 Wait states > Asserted to ...

Page 28

Timing is both wait state and frequency dependent. In the formulas listed the number of wait states and T = Clock Period. For 80MHz operation 12.5ns. 2. Parameters listed are guaranteed by design. To calculate ...

Page 29

Reset, Stop, Wait, Mode Select, and Interrupt Timing Table 15. Reset, Stop, Wait, Mode Select, and Interrupt Timing Operating Conditions SSIO SS SSA Characteristic RESET Assertion to Address, Data and Control Signals High Impedance Minimum ...

Page 30

RESET t RAZ A0–A15, D0–D15 PS, DS, RD, WR Figure 13. Asynchronous Reset Timing IRQA, IRQB Figure 14. External Interrupt Timing (Negative-Edge-Sensitive) A0–A15, PS, DS, RD IDM IRQA, IRQB General Purpose I/O Pin t IG IRQA, IRQB Figure ...

Page 31

IRQA, IRQB A0–A15, PS, DS, RD, WR Figure 16. Interrupt from Wait State Timing t IW IRQA A0–A15, PS, DS, RD, WR Figure 17. Recovery from Stop State Using Asynchronous Interrupt Timing IRQA A0–A15 PS, DS, RD, WR Figure 18. ...

Page 32

Serial Peripheral Interface (SPI) Timing Operating Conditions SSIO SS SSA Characteristic Cycle time Master Slave Enable lead time Master Slave Enable lag time Master Slave Clock (SCLK) high time Master Slave Clock (SCLK) low time ...

Page 33

SS (Input) SCLK (CPOL = 0) (Output) SCLK (CPOL = 1) (Output MISO (Input) MOSI (Output) Figure 19. SPI Master Timing (CPHA = 0) SS (Input) SCLK (CPOL = 0) (Output) SCLK (CPOL = 1) (Output) MISO (Input) ...

Page 34

SS (Input) SCLK (CPOL = 0) (Input) t ELD SCLK (CPOL = 1) (Input) t MISO Slave MSB out (Output MOSI (Input) Figure 21. SPI Slave Timing (CPHA = 0) SS (Input) SCLK (CPOL = 0) (Input) SCLK ...

Page 35

Quad Timer Timing Operating Conditions SSIO SS SSA Characteristic Timer input period Timer input high/low period Timer output period Timer output high/low period 1. In the formulas listed clock cycle. For 80MHz operation, ...

Page 36

RXD SCI receive data pin (Input) TXD SCI receive data pin (Input) 3.11 JTAG Timing Operating Conditions SSIO SS SSA Characteristic 2 TCK frequency of operation TCK cycle time TCK clock pulse width TMS, TDI data ...

Page 37

V IH TCK (Input – Figure 26. Test Clock Input Timing Diagram TCK (Input) TDI TMS (Input TDO (Output TDO (Output ) t DV TDO ...

Page 38

Part 4 Packaging 4.1 Package and Pin-Out Information DSP56F826 This section contains package and pin-out information for the 100-pin LQFP configuration of the DSP56F826. TMS TDI TDO PIN 1 TRST VDDIO VSSIO A15 A14 A13 A12 A11 A10 A9 A8 ...

Page 39

Table 20. DSP56F826 Pin Identification by Pin Number Signal Pin No. Pin No. Name 1 TMS 26 2 TDI 27 3 TDO 28 4 TRST 29 5 VDDIO 30 6 VSSIO 31 7 A15 32 8 A14 33 9 A13 ...

Page 40

S 0.15(0.006 -T- - 0.15(0.006 T-U AE -AB- 96X (24X PER SIDE 0.25 (0.010 GAUGE PLANE DETAIL AD Figure 31. 100-pin LQPF Mechanical Information ...

Page 41

Part 5 Design Considerations 5.1 Thermal Design Considerations An estimation of the chip junction temperature, T Equation Where ambient temperature ° package junction-to-ambient thermal resistance °C ...

Page 42

Use the value obtained by the equation (T case determined by a thermocouple. The junction-to-case thermal resistances quoted in this data sheet are determined using the first definition on page 41. From a practical standpoint, that value is also ...

Page 43

Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the V • All inputs must ...

Page 44

OnCE™ are trademarks of Motorola, Inc. This document contains information on a new product. Specifications and information herein are subject to change without notice. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes ...

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