W25X10BLSNIG WINBOND [Winbond], W25X10BLSNIG Datasheet - Page 50

• Manufacturer Part Number: W25X10BLSNIG
• Description: 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
• Manufacturer: WINBOND [Winbond]

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SOLDER PATTERN
SYMBOL
M
N
Q
R
P
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
- 50 -
MAX
W25X10BL/20BL/40BL
MIN
INCHES
0.1338
0.1692
0.2360
0.0196
0.0255
TYP.
MAX