W25X20A WINBOND [Winbond], W25X20A Datasheet

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W25X20A

Manufacturer Part Number
W25X20A
Description
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
Manufacturer
WINBOND [Winbond]
Datasheet

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W25X10A, W25X20A, W25X40A, W25X80A
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date: February 27, 2008
- 1 -
Revision B

Related parts for W25X20A

W25X20A Summary of contents

Page 1

... W25X10A, W25X20A, W25X40A, W25X80A 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: February 27, 2008 - 1 - Revision B ...

Page 2

... W25X10A, W25X20A, W25X40A, W25X80A 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5 4. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5 5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5 6. PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6 7. PIN DESCRIPTION..................................................................................................................... 6 7.1 Package Types ............................................................................................................... 7 7.2 Chip Select (/CS) ............................................................................................................ 7 7.3 Serial Data Output (DO) ................................................................................................. 7 7.4 Write Protect (/WP)......................................................................................................... 7 7 ...

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... W25X10A, W25X20A, W25X40A, W25X80A 10.2.6 Write Status Register (01h) ..........................................................................................18 10.2.7 Read Data (03h) ...........................................................................................................19 10.2.8 Fast Read (0Bh) ...........................................................................................................20 10.2.9 Fast Read Dual Output (3Bh) .......................................................................................21 10.2.10 Page Program (02h) ...................................................................................................22 10.2.11 Sector Erase (20h) .....................................................................................................23 10.2.12 Block Erase (D8h) ......................................................................................................24 10.2.13 Chip Erase (C7h)........................................................................................................25 10.2.14 Power-down (B9h) ......................................................................................................26 10.2.15 Release Power-down / Device ID (ABh) .....................................................................27 10.2.16 Read Manufacturer / Device ID (90h) .........................................................................29 10 ...

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... W25X10A, W25X20A, W25X40A, W25X80A 1. GENERAL DESCRIPTION The W25X10A (1M-bit), W25X20A (2M-bit), W25X40A (4M-bit) and W25X80A (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µ ...

Page 5

... Figure 1a. W25X10A, W25X20A, W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SN) 4. PIN CONFIGURATION SOIC 208-MIL Figure 1b. W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SS) 5. PIN CONFIGURATION PDIP 300-MIL Figure 1c. W25X10A, W25X20A, W25X40A and W25X80A Pin Assignments, 8-pin PDIP (Package Code DA) Publication Release Date: February 27, 2008 - 5 - Revision B ...

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... W25X10A, W25X20A, W25X40A, W25X80A 6. PAD CONFIGURATION WSON 6X5-MM Figure 1d. W25X10A, W25X20A, W25X40A and W25X80A Pad Assignments, 8-pad WSON (Package Code ZP) 7. PIN DESCRIPTION SOIC 150-mil, SOIC 208-mil, PDIP 300-mil, and WSON 6x5-mm PIN NO. PIN NAME 1 / /WP 4 GND 5 DIO 6 CLK ...

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... W25X10A, W25X20A, W25X40A, W25X80A 7.1 Package Types At the time this datasheet was published not all package types had been finalized. Contact Winbond to confirm availability of these packages before designing to this specification. All parts are offered in an 8-pin plastic 150-mil width SOIC (package code SN) as shown in figure 1a. The W25X40A and W25X80A are offered in an 8-pin plastic 208-mil width SOIC (package code SS) as shown in figure 1b ...

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... W25X10A, W25X20A, W25X40A, W25X80A 8. BLOCK DIAGRAM Figure 2. W25X10A, W25X20A, W25X40A and W25X80A Block Diagram - 8 - ...

Page 9

... W25X10A, W25X20A, W25X40A, W25X80A 9. FUNCTIONAL DESCRIPTION 9.1 SPI OPERATIONS 9.1.1 SPI Modes The W25X10A/20A/40A/80A is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK), Chip Select (/CS), Serial Data Input/Output (DIO) and Serial Data Output (DO). Both SPI bus operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not being transferred to the Serial Flash ...

Page 10

... W25X10A, W25X20A, W25X40A, W25X80A 9.2 WRITE PROTECTION Applications that use non-volatile memory must take into consideration the possibility of noise and other adverse system conditions that may compromise data integrity. To address this concern the W25X10A/20A/40A/80A provides several means to protect data from inadvertent writes. ...

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... W25X10A, W25X20A, W25X40A, W25X80A 10. CONTROL AND STATUS REGISTERS The Read Status Register instruction can be used to provide status on the availability of the Flash memory array, if the device is write enabled or disabled, and the state of write protection. The Write Status Register instruction can be used to configure the device write protection features. See Figure 3. ...

Page 12

... W25X10A, W25X20A, W25X40A, W25X80A 10.1.6 Status Register Protect (SRP) The Status Register Protect (SRP) bit is a non-volatile read/write bit in status register (S7) that can be used in conjunction with the Write Protect (/WP) pin to disable writes to status register. When the SRP bit is set state (factory default) the /WP pin has no control over status register. When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low ...

Page 13

... NONE 7 070000h - 07FFFFh 6 and 7 060000h - 07FFFFh 4 thru 7 040000h - 07FFFFh 0 000000h - 00FFFFh 0 and 1 000000h - 01FFFFh 0 thru 3 000000h - 03FFFFh 0 thru 7 000000h - 07FFFFh W25X20A (2M-BIT) MEMORY PROTECTION BLOCK(S) ADDRESSES NONE NONE 3 030000h - 03FFFFh 2 and 3 020000h - 03FFFFh 0 000000h - 00FFFFh 0 and 1 000000h - 01FFFFh 0 thru 3 000000h - 03FFFFh ...

Page 14

... W25X10A, W25X20A, W25X40A, W25X80A 10.2 INSTRUCTIONS The instruction set of the W25X10A/20A/40A/80A consists of fifteen basic instructions that are fully controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction code ...

Page 15

... W25X10A, W25X20A, W25X40A, W25X80A (1) 10.2.2 Instruction Set INSTRUCTION BYTE 1 BYTE 2 NAME CODE Write Enable 06h Write Disable 04h Read Status 05h (S7–S0) Register Write Status 01h S7–S0 Register Read Data 03h A23–A16 Fast Read 0Bh A23–A16 Fast Read Dual 3Bh A23– ...

Page 16

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.3 Write Enable (06h) The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase and Write Status Register instruction. The Write Enable instruction is entered by driving /CS low, shifting the instruction code “ ...

Page 17

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.5 Read Status Register (05h) The Read Status Register instruction allows the 8-bit Status Register to be read. The instruction is entered by driving /CS low and shifting the instruction code “05h” into the DIO pin on the rising edge of CLK. The status register bits are then shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown in figure 6 ...

Page 18

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.6 Write Status Register (01h) The Write Status Register instruction allows the Status Register to be written. A Write Enable instruction must previously have been executed for the device to accept the Write Status Register Instruction (Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by driving /CS low, sending the instruction code “ ...

Page 19

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.7 Read Data (03h) The Read Data instruction allows one more data bytes to be sequentially read from the memory. The instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed by a 24-bit address (A23-A0) into the DIO pin. The code and address bits are latched on the rising edge of the CLK pin ...

Page 20

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.8 Fast Read (0Bh) The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest possible frequency of F eight “dummy” clocks after the 24-bit address as shown in figure 9. The dummy clocks allow the devices internal circuits additional time for setting up the initial address. During the dummy clocks the data value on the DIO pin is a “ ...

Page 21

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.9 Fast Read Dual Output (3Bh) The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except that data is output on two pins, DO and DIO, instead of just DO. This allows data to be transferred from the W25X10A/20A/40A/80A at twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for applications that cache code-segments to RAM for execution ...

Page 22

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.10 Page Program (02h) The Page Program instruction allows up to 256 bytes of data to be programmed at previously erased to all 1s (FFh) memory locations. A Write Enable instruction must be executed before the device will accept the Page Program Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low then shifting the instruction code “ ...

Page 23

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.11 Sector Erase (20h) The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code “ ...

Page 24

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.12 Block Erase (D8h) The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code “ ...

Page 25

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.13 Chip Erase (C7h or 60h) The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code “ ...

Page 26

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.14 Power-down (B9h) Although the standby current during normal operation is relatively low, standby current can be further reduced with the Power-down instruction. The lower power consumption makes the Power-down instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code “ ...

Page 27

... Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 17. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A are listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction is completed by driving /CS high ...

Page 28

... W25X10A, W25X20A, W25X40A, W25X80A Figure 17. Release Power-down / Device ID Instruction Sequence Diagram - 28 - ...

Page 29

... Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 18. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID ...

Page 30

... W25X10A, W25X20A, W25X40A, W25X80A 10.2.17 JEDEC ID (9Fh) For compatibility reasons, the W25X10A/20A/40A/80A provides several instructions to electronically determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The ...

Page 31

... Lead Temperature Electrostatic Discharge Voltage Notes: 1. Specification for W25X10A, W25X20A, W25X40A and W25X80A is preliminary. See preliminary designation at the end of this document. 2. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability ...

Page 32

... W25X10A, W25X20A, W25X40A, W25X80A 11.3 Endurance and Data Retention PARAMETER Erase/Program Cycles 4KB sector, 64KB block or full chip. Data Retention 55°C 11.4 Power-up Timing and Write Inhibit Threshold PARAMETER VCC (min) to /CS Low Time Delay Before Write Instruction Write Inhibit Threshold Voltage Note: 1 ...

Page 33

... W25X10A, W25X20A, W25X40A, W25X80A 11.5 DC Electrical Characteristics PARAMETER SYMBOL CONDITIONS Input Capacitance C (1) IN Output Capacitance Cout (1) Input Leakage I LI I/O Leakage I LO Standby Current Power-down Current Current Read Data / Dual Output 1MHz (2) Current Read Data / Dual Output 33MHz (2) Current Read Data / ...

Page 34

... W25X10A, W25X20A, W25X40A, W25X80A 11.6 AC Measurement Conditions PARAMETER Load Capacitance Load Capacitance for F only R1 Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. SYMBOL ...

Page 35

... W25X10A, W25X20A, W25X40A, W25X80A 11.7 AC Electrical Characteristics DESCRIPTION Clock frequency for all instructions, except Read Data (03h) 2.7V-3.6V VCC & Industrial Temperature Clock frequency, for Fast Read (0Bh, 3Bh) only 3.0V-3.6V VCC & Commercial Temperature Clock freq. Read Data instruction 03h Clock High, Low Time, for Fast Read (0Bh, 3Bh) / ...

Page 36

... Byte Program Time (First Byte) Additional Byte Program Time (After First Byte) Page Program Time Sector Erase Time (4KB) Block Erase Time (64KB) Chip Erase Time W25X10A / W25X20A Chip Erase Time W25X40A Chip Erase Time W25X80A Notes: 1. Clock high + Clock low must be less than or equal to 1/f 2 ...

Page 37

... W25X10A, W25X20A, W25X40A, W25X80A 11.9 Serial Output Timing 11.10 Input Timing 11.11 Hold Timing Publication Release Date: February 27, 2008 - 37 - Revision B ...

Page 38

... W25X10A, W25X20A, W25X40A, W25X80A 12. PACKAGE SPECIFICATION 12.1 8-Pin SOIC 150-mil (Package Code SN) SYMBOL MIN A 1.47 A1 0.10 A2 --- b 0.33 C 0.19 D (3) 4.80 E 5.80 E1 (3) 3.80 e ( θ CP --- Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package ...

Page 39

... W25X10A, W25X20A, W25X40A, W25X80A 12.2 8-Pin SOIC 208-mil (Package Code SS) SYMBOL ( (3) e (2) L θ y Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package ...

Page 40

... W25X10A, W25X20A, W25X40A, W25X80A 12.3 8-Pin PDIP 300-mil (Package Code DA SYMBOL MIN A --- A1 0.25 A2 3.18 B 0.41 B1 1.47 c 0.20 D --- E 7.37 E1 6.22 e1 2.29 L 3.05 α 8. --- Seating Plane Base Plane α MILLIMETERS TYP. MAX MIN --- 4.45 --- --- --- 0.010 3.30 3.43 0.125 0.46 0.56 0.016 1.52 1.63 0.058 0.25 0.36 0.008 9.14 9.65 --- 7.62 7.87 0.290 6.35 6.48 0.245 2.54 2.79 0.090 3.30 3.56 0.120 ...

Page 41

... W25X10A, W25X20A, W25X40A, W25X80A 12.4 8-Pad WSON 6x5mm (Package Code ZP) SYMBOL ( ( MILLIMETERS MIN TYP. MAX 0.70 0.75 0.80 0.0276 0.00 0.02 0.05 0.0000 0.55 0.19 .0.20 0.25 0.0075 0.36 0.40 0.48 0.0138 5.90 6.00 6.10 0.2320 3.30 3.40 3.50 0.1299 4.90 5.00 5.10 0.1930 4.20 4.30 4.40 0.1653 1.27 BSC 0.20 0.0080 0.50 0.60 0.75 0.0197 Publication Release Date: February 27, 2008 - 41 - INCHES MIN TYP. MAX ...

Page 42

... W25X10A, W25X20A, W25X40A, W25X80A 12.5 8-Pad WSON 6x5mm Cont’d. MILLIMETERS SYMBOL MIN SOLDER PATTERN Notes: 1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package ...

Page 43

... Lead Free (Lead-free, RoHS Compliant) Notes: 1a. The Winbond W25X10A, W25X20A, W25X40A and W25X80A are fully compatible with the previous Winbond W25X10, W25X20, W25X40 and W25X80 Serial Flash Memories. 1b. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T), when placing orders. 1c. The “ ...

Page 44

... W25X10A, W25X20A, W25X40A, W25X80A Valid Part Numbers and Top Side Marking: The following table provides the valid part numbers for the 25X10A/20A/40A/80A SpiFlash Memories. Please contact Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages use an abbreviated 10-digit number ...

Page 45

... W25X10A, W25X20A, W25X40A, W25X80A 14. REVISION HISTORY VERSION DATE PAGE A 01/09/08 B 02/27/08 43 & 44 Preliminary Designation The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully characterized. The specifications are subject to change and are not guaranteed. Winbond or an authorized sales representative should be consulted for current information before using this product ...

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