W25X20A WINBOND [Winbond], W25X20A Datasheet - Page 3

• Manufacturer Part Number: W25X20A
• Description: 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
• Manufacturer: WINBOND [Winbond]

11.
12.
13.
14.
ELECTRICAL CHARACTERISTICS......................................................................................... 31
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
PACKAGE SPECIFICATION .................................................................................................... 38
12.1
12.2
12.3
12.4
12.5
ORDERING INFORMATION .................................................................................................... 43
REVISION HISTORY ................................................................................................................ 45
10.2.6
10.2.7
10.2.8
10.2.9
10.2.10
10.2.11
10.2.12
10.2.13
10.2.14
10.2.15
10.2.16
10.2.17
Absolute Maximum Ratings .......................................................................................... 31
Operating Ranges......................................................................................................... 31
Endurance and Data Retention .................................................................................... 32
Power-up Timing and Write Inhibit Threshold .............................................................. 32
DC Electrical Characteristics ........................................................................................ 33
AC Measurement Conditions........................................................................................ 34
AC Electrical Characteristics ........................................................................................ 35
AC Electrical Characteristics (cont’d) ........................................................................... 36
Serial Output Timing ..................................................................................................... 37
8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
8-Pad WSON 6x5mm (Package Code ZP) .................................................................. 41
8-Pad WSON 6x5mm Cont’d........................................................................................ 42
Input Timing................................................................................................................. 37
Hold Timing ................................................................................................................. 37
Write Status Register (01h) ..........................................................................................18
Read Data (03h) ...........................................................................................................19
Fast Read (0Bh) ...........................................................................................................20
Fast Read Dual Output (3Bh) .......................................................................................21
W25X10A, W25X20A, W25X40A, W25X80A
Page Program (02h) ...................................................................................................22
Sector Erase (20h) .....................................................................................................23
Block Erase (D8h) ......................................................................................................24
Chip Erase (C7h)........................................................................................................25
Power-down (B9h) ......................................................................................................26
Release Power-down / Device ID (ABh) .....................................................................27
Read Manufacturer / Device ID (90h) .........................................................................29
JEDEC ID (9Fh)..........................................................................................................30
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Publication Release Date: February 27, 2008
Revision B