W25X20A WINBOND [Winbond], W25X20A Datasheet - Page 38

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W25X20A

Manufacturer Part Number
W25X20A
Description
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
Manufacturer
WINBOND [Winbond]
Datasheet

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12.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
12. PACKAGE SPECIFICATION
package.
SYMBOL
E1 (3)
D (3)
e (2)
CP
A1
A2
C
A
b
E
L
θ
W25X10A, W25X20A, W25X40A, W25X80A
MIN
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
0 o
---
---
MILLIMETERS
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
MAX
- 38 -
1.72
0.24
0.50
0.25
4.95
6.19
4.00
1.27
0.10
---
8 o
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
0 o
---
---
0.050 BSC
INCHES
0.057
0.063
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.068
0.009
0.020
0.195
0.244
0.157
0.050
0.004
MAX
8 o
---

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