W25Q16CLDAIG WINBOND [Winbond], W25Q16CLDAIG Datasheet - Page 70

• Manufacturer Part Number: W25Q16CLDAIG
• Description: 2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

13.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SYMBOL
A1
A2
D1
E1
e
A
C
D
E
H
b
L
θ
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 70 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
0.050 BSC.
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
W25Q16CL
GAUGE PLANE
GAUGE PLANE