W25Q16CLDAIG WINBOND [Winbond], W25Q16CLDAIG Datasheet - Page 73

• Manufacturer Part Number: W25Q16CLDAIG
• Description: 2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 73 -
Max
Min
Publication Release Date: July 08, 2010
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Preliminary - Revision A
Max
W25Q16CL