STK11C68-L SIMTEK [Simtek Corporation], STK11C68-L Datasheet

STK11C68-L

Manufacturer Part Number

STK11C68-L

Description

Statement of Material Content Ceramic LCC Packages

Manufacturer

SIMTEK [Simtek Corporation]

Datasheet

1.STK11C68-L.pdf (2 pages)

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

STK11C68-L35M

Quantity:

Current page: 1 of 2
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PL0122

Detail

PACKAGE MATERIALS

Simtek Package ID

Pin/Lead Count

Simtek package pn

Package Manufacturer

Mfg Pkg ID/Simtek part ID/Dwg ID

Simtek package Outline

JEDEC Case Outline

Mil Case Outline ID

Assembly Facility

Plant

Leadframe Plating

Plating Process

Ceramic

Leads

Lead Plating [Gold Underplate]

Leads [Hot Solder Dip Finish]

PACKAGE DIMENSIONS & CHARACTERISTICS

Nominal Cavity Volume

Die Size

Pad Size

Theta Ja [still air] -approx

Theta Ja [200fpm/1mps] - approx

Theta Jc

Lead Resistance

Lead to Lead Capacitance

SHIPPING INFORMATION

Carrier Type

Units Per Rail

Total Product Weight

LID DETAIL

Manufacturer

Lid Type

Simtek Lid ID

Dimensions

Lid Material

Plating

Plating Process

Frame

Frame Thickness

C/W

Unit

mil

qty

µ"

L [hot solder dip lead finish]

STK-91-01-2303

Kyocera

PB-CA1771 / STK-91-01-2803

STK-40-05-007

MO-041

Figure C11, CQCC3-N28

Amkor Technologies

ATP1

Gold Plate 60µ" min over 80-250µ" Nickel

Electrolytic

Kyocera 440 Black [Al

Alloy 42 [Fe 58% / Ni 42%]

Gold Plate 80µ"

Sn/Pb 60/40%

.0035

146x153x19

214x205

800 mOhm Max

3pF max [1MHz]

rail

0.9

Williams Advanced Materials

Hi Rel Lid with Preform

STK-92-10-0003

.330x.530 .280x.480 .01"

Kovar [Fe 54% / Co 17% / Ni 29%]

Gold 25µ" min on Nickel 50-350µ"

Electrolytic

Au 80% / Sn 20%

.002"

28 350 LEADLESS CHIP CARRIER

Simtek Corporation

This package type is not available in a lead-free version.

90%]

Statement of Material Content

L [hot solder dip lead finish]

STK-91-01-3202

NTK Technical Ceramics

IRK32F1-5379C / STK-91-01-3202

STK-40-05-011

MO-041

Figure C11, CQCC3-N32

Amkor Technologies

ATP1

Gold Plate 80µ" min Over 50-350µ" Nickel

Electrolytic

NTK ALN

Alloy 42 [Fe 58% / Ni 42%]

Gold Plate 80µ"

Sn/Pb 60/40%

.0062

144x374x19

310x440

500 mOhm Max

3pF max [1MHz]

rail

1.3

Williams Advanced Materials

Hi Rel Lid with Preform

STK-92-10-0007

.430x.530 .360x.500 .01 "

Kovar [Fe 54% / Co 17% / Ni 29%]

Gold 25µ" min on Nickel 50-350µ"

Electrolytic

Au 80% / Sn 20%

.002"

Ceramic LCC Packages

32 450 LEADLESS CHIP CARRIER

STK11C68-L

STK12C68-L

STK14C88-L

August 07

Related parts for STK11C68-L

STK11C68-L Summary of contents

Page 1

... Gold 25µ" min on Nickel 50-350µ" µ" Electrolytic Au 80 20% .002" in Simtek Corporation Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L 32 450 LEADLESS CHIP CARRIER L [hot solder dip lead finish] 32 STK-91-01-3202 NTK Technical Ceramics IRK32F1-5379C / STK-91-01-3202 ...

Page 2

... C=0 Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure 10,000 In D/A, Wire Bond Areas Simtek Corporation Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L 32 450 LEADLESS CHIP CARRIER JMI 7000 Johnson Matthey Silver Glass 0.5 - 1.0 mil 19 mil None Al 99.99% 1.25 mil ...

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