SSM3J13T_07 TOSHIBA [Toshiba Semiconductor], SSM3J13T_07 Datasheet

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SSM3J13T_07

Manufacturer Part Number
SSM3J13T_07
Description
Field Effect Transistor Silicon P Channel MOS Type (U-MOSII)
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
Power Management Switch
High Speed Switching Applications
Absolute Maximum Ratings
Marking
Handling Precaution
Small Package
Low on Resistance : R
Low Gate Threshold Voltage
Drain-Source voltage
Gate-Source voltage
Drain current
Drain power dissipation
Channel temperature
Storage temperature range
Note:
Note 1: Mounted on FR4 board
Note 2: The pulse width limited by max channel temperature.
environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and
containers and other objects that come into direct contact with devices should be made of anti-static materials.
the board material, board area, board thickness and pad area, and are also affected by the environment in
which the product is used. When using this device, please take heat dissipation fully into account
When handling individual devices (which are not yet mounted on a circuit board), be sure that the
The Channel-to-Ambient thermal resistance R
1
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm
KDH
Characteristics
3
2
: R
on
on
DC
Pulse
= 70 mΩ (max) (@V
= 95 mΩ (max) (@V
Silicon P Channel MOS Type (U-MOSII)
(Ta = 25°C)
TOSHIBA Field Effect Transistor
Symbol
SSM3J13T
V
V
T
I
T
P
GSS
I
DP
(Note 2)
(Note 1)
DS
stg
D
ch
Equivalent Circuit
D
GS
GS
= −4 V)
= −2.5 V)
1
th (ch-a)
−55~150
Rating
−3.0
−6.0
1.25
−12
150
2
±8
, t = 10 s)
1
3
and the drain power dissipation P
2
Unit
°C
°C
W
V
V
A
Weight: 10 mg (typ.)
JEDEC
JEITA
TOSHIBA
D
vary according to
SSM3J13T
2-3S1A
2007-11-01
Unit: mm

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SSM3J13T_07 Summary of contents

Page 1

Power Management Switch High Speed Switching Applications • Small Package • Low on Resistance : mΩ (max) (@ mΩ (max) (@V on • Low Gate Threshold Voltage Absolute Maximum Ratings Characteristics Drain-Source ...

Page 2

Electrical Characteristics Characteristics Gate leakage current Drain-Source breakdown voltage Drain Cut-off current Gate threshold voltage Forward transfer admittance Drain-Source ON resistance Input capacitance Reverse transfer capacitance Output capacitance Turn-on time Switching time Turn-off time Note 3: Pulse test Switching Time ...

Page 3

I – −4 −4 V Common Source −2 25°C −2.0 V −1.6 V −1.8 V −3 −2 − −1 −0.5 −1 −1.5 0 Drain-Source voltage V DS (V) R ...

Page 4

V – −1 Common Source − −0.1 mA −0.8 −0.6 −0.4 −0.2 0 − 100 Ambient temperature Ta (°C) t – 1000 Common Source V ...

Page 5

Safe operating area − max (pulsed max (continuous −1 DC operation −0.1 Mounted on FR4 board (25.4 mm × 25.4 mm × 1 Pad: 645 Single ...

Page 6

RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and ...

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