LM759 National Semiconductor, LM759 Datasheet - Page 6

• Manufacturer Part Number: LM759
• Description: Power Operational Amplifiers
• Manufacturer: National Semiconductor

Solving T
Where
Plastic Package (P)
Metal Can (H)
P
T
T
T
P
D Max
CA
J
J
A
D
JA
JC
CA
CS
SA
e
e
Package
e
e
e
e
e
e
e
e
e
T
T
J
A
A
e
e
Junction Temperature
Ambient Temperature
Power Dissipation
Junction to ambient thermal resistance
Junction to case thermal resistance
Case to ambient thermal resistance
Case to heat sink thermal resistance
Heat sink to ambient thermal resistance
CS
a
a
T
T
J Max
J Max
P
P
JC
a
D
D JA
a
(
JA
SA
JC
b
b
(without a heat sink)
CA
T
T
a
A
A
Typ
C W
or
(without a heat sink)
8 0
30
CA
JC
) or
Max
C W
12
40
JC
Typ
C W
120
75
JA
Max
C W
150
80
JA
6
Mounting Hints
Metal Can Package (LM759CH LM759MH)
The LM759 in the 8-Lead TO-99 metal can package must
be used with a heat sink With
LM759 can dissipate up to 540 mW in its quiescent (no
load) state This would result in a 100 C rise in chip temper-
ature to 125 C (assuming a 25 C ambient temperature) In
order to avoid this problem it is advisable to use either a slip
on or stud mount heat sink with this package If a stud
mount heat sink is used it may be necessary to use insulat-
ing washers between the stud and the chassis because the
case of the LM759 is internally connected to the negative
power supply terminal
Plastic Package (LM759CP LM77000CP)
The LM759CP and LM77000CP are designed to be at-
tached by the tab to a heat sink This heat sink can be either
one of the many heat sinks which are commercially avail-
able a piece of metal such as the equipment chassis or a
suitable amount of copper foil as on a double sided PC
board The important thing to remember is that the negative
power supply connection to the op amp must be made
through the tab Furthermore adequate heat sinking must
be provided to keep the chip temperature below 125 C un-
der worst case load and ambient temperature conditions
g
15V power supplies the