K4S563233FHN Samsung semiconductor, K4S563233FHN Datasheet

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K4S563233FHN

Manufacturer Part Number
K4S563233FHN
Description
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Manufacturer
Samsung semiconductor
Datasheet
K4S563233F - F(H)E/N/G/C/L/F
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
FEATURES
• 3.0V & 3.3V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
• Burst read single-bit write operation.
• Special Function Support.
• DQM for masking.
• Auto refresh.
• 64ms refresh period (4K cycle).
• Commercial Temperature Operation (-25°C ~ 70°C).
• Extended Temperature Operation (-25°C ~ 85°C).
• 90Balls FBGA ( -FXXX -Pb, -HXXX -Pb Free).
ORDERING INFORMATION
- F(H)E/N/G : Normal/Low/Super Low Power, Extended Temperature(-25°C ~ 85°C)
- F(H)C/L/F : Normal/Low/Super Low Power, Commercial Temperature(-25°C ~ 70°C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific pur
pose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
clock.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
K4S563233F-F(H)E/N/G/C/L/F1H
K4S563233F-F(H)E/N/G/C/L/F60
K4S563233F-F(H)E/N/G/C/L/F75
K4S563233F-F(H)E/N/G/C/L/F1L
Part No.
133MHz(CL=3),111MHz(CL=2)
111MHz(CL=3)*1
166MHz(CL=3)
111MHz(CL=2)
Max Freq.
GENERAL DESCRIPTION
rate Dynamic RAM organized as 4 x 2,097,152 words by 32 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
1
The K4S563233F is 268,435,456 bits synchronous high data
Interface
LVCMOS
Mobile-SDRAM
90 FBGA Pb
(Pb Free)
Package
May 2004

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K4S563233FHN Summary of contents

Page 1

... K4S563233F - F(H)E/N/G/C/L 32Bit x 4 Banks Mobile SDRAM in 90FBGA FEATURES • 3.0V & 3.3V power supply. • LVCMOS compatible with multiplexed address. • Four banks operation. • MRS cycle with address key programs. -. CAS latency (1, 2 & 3). -. Burst length ( & Full page). ...

Page 2

... Bank Select CLK ADD LCKE LRAS LCBR LWE CLK CKE CS Data Input Register Column Decoder Latency & Burst Length Programming Register LCAS LWCBR Timing Register RAS CAS WE DQM 2 Mobile-SDRAM LWE LDQM DQi LDQM May 2004 ...

Page 3

... CAS WE DQM ~ DQM DDQ SSQ Symbol Mobile-SDRAM *2 < Top View > 90Ball(6x15) FBGA DQ24 V V DQ23 DQ21 DQ19 DDQ SSQ DDQ SSQ DQ27 DQ25 DQ22 DQ20 V ...

Page 4

... SS A Min Typ 2.7 3.0 2.7 3.0 2.2 3 DDQ -0 2 -10 - =0.9V ± 50 mV) = 23° 1MHz REF Symbol Min C - CLK ADD C - OUT 4 Mobile-SDRAM Value Unit -1.0 ~ 4.6 V -1.0 ~ 4.6 V °C -55 ~ +150 1 Max Unit Note 3 -2mA OH 0 2mA Max Unit Note 4 ...

Page 5

... IL CC (min), CS ≥ V (min 10ns (min), CLK ≤ ∞ (max 2CLKs ≥ t (min) RC -E/C -N/L Internal TCSR Full Array -G/F 1/2 of Full 1/4 of Full 5 Mobile-SDRAM Version Unit Note -60 -75 -1H -1L 110 100 100 0 120 ...

Page 6

... VOL (DC) = 0.4V, IOL = 2mA 30pF 870Ω Figure 1. DC Output Load Circuit = 2.7V ∼ 3.6V -25 to 85°C for Extended, -25 to 70°C for Commercial Value 2.4 / 0.4 1.4 tr/tf = 1/1 1.4 See Figure 2 Output Z0=50Ω Figure 2. AC Output Load Circuit 6 Mobile-SDRAM Unit Vtt=0.5 x VDDQ 50Ω 30pF May 2004 ...

Page 7

... RP (min RAS (max) 100 RAS t (min (min) 2 RDL (min) tRDL + tRP DAL (min) 1 CDL (min) 1 BDL (min) 1 CCD Mobile-SDRAM Unit Note -1H - CLK CLK 2 CLK 2 CLK ...

Page 8

... SAC SAC SAC t 2.5 2.5 2 2.5 2 2.5 2 2.5 2 2.0 2.0 2 1.0 1.0 1 SLZ 5 SHZ - - 8 Mobile-SDRAM -1H -1L Unit Note Max Min Max 9.0 1000 1000 1 2 2 ...

Page 9

... MRS can be issued only at all banks precharge state. A new command can be issued after 2 CLK cycles of MRS. 3. Auto refresh functions are the same as CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. ...

Page 10

... Mode Select EMRS for PASR(Partial Array Self Ref.) Mode Select BA1 BA0 0 0 Normal MRS 0 1 Reserved 1 0 EMRS for Mobile SDRAM 1 1 Reserved Reserved Address A11~A10/ NOTES: 1. RFU(Reserved for future use) should stay "0" during MRS cycle. ...

Page 11

... K4S563233F - F(H)E/N/G/C/L/F Partial Array Self Refresh 1. In order to save power consumption, Mobile SDRAM has PASR option. 2. Mobile SDRAM supports 3 kinds of PASR in self refresh mode : Full Array, 1/2 of Full Array and 1/4 of Full Array. BA1=0 BA1=0 BA0=0 BA0=1 BA1=1 BA1=1 BA0=0 BA0=1 - Full Array Temperature Compensated Self Refresh 1. In order to save power consumption, Mobile-DRAM includes the internal temperature sonsor and control units to control the self refresh cycle automatically according to the two temperature range : Max 40 ° ...

Page 12

... Mobile-SDRAM Interleave Interleave ...

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