SST39VF800A704IEKE Silicon Storage Technology, Inc, SST39VF800A704IEKE Datasheet

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SST39VF800A704IEKE

Manufacturer Part Number
SST39VF800A704IEKE
Description
TSOP48
Manufacturer
Silicon Storage Technology, Inc
Datasheet

Specifications of SST39VF800A704IEKE

Date_code
05+
FEATURES:
• Organized as 128K x16 / 256K x16 / 512K x16
• Single Voltage Read and Write Operations
• Superior Reliability
• Low Power Consumption
• Sector-Erase Capability
• Block-Erase Capability
• Fast Read Access Time
• Latched Address and Data
PRODUCT DESCRIPTION
The SST39LF200A/400A/800A and SST39VF200A/400A/
800A devices are 128K x16 / 256K x16 / 512K x16 CMOS
Multi-Purpose Flash (MPF) manufactured with SST’s pro-
prietary, high performance CMOS SuperFlash technology.
The split-gate cell design and thick oxide tunneling injector
attain better reliability and manufacturability compared with
alternate approaches. The SST39LF200A/400A/800A
write (Program or Erase) with a 3.0-3.6V power supply. The
SST39VF200A/400A/800A write (Program or Erase) with a
2.7-3.6V power supply. These devices conform to JEDEC
standard pinouts for x16 memories.
Featuring
SST39LF200A/400A/800A
800A devices provide a typical Word-Program time of 14
µsec. The devices use Toggle Bit or Data# Polling to detect
the completion of the Program or Erase operation. To pro-
tect against inadvertent write, they have on-chip hardware
and software data protection schemes. Designed, manu-
factured, and tested for a wide spectrum of applications,
these devices are offered with a guaranteed endurance of
10,000 cycles. Data retention is rated at greater than 100
years.
The SST39LF200A/400A/800A and SST39VF200A/400A/
800A devices are suited for applications that require conve-
nient and economical updating of program, configuration,
or data memory. For all system applications, they signifi-
©2002 Silicon Storage Technology, Inc.
S71117-04-000 2/02
1
– 3.0-3.6V for SST39LF200A/400A/800A
– 2.7-3.6V for SST39VF200A/400A/800A
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
– Active Current: 20 mA (typical)
– Standby Current: 3 µA (typical)
– Uniform 2 KWord sectors
– Uniform 32 KWord blocks
– 45 and 55 ns for SST39LF200A/400A
– 55 ns for SST39LF800A
– 70 and 90 ns for SST39VF200A/400A/800A
2 Mbit / 4 Mbit / 8 Mbit (x16) Multi-Purpose Flash
high
SST39LF/VF200A / 400A / 800A3.0 & 2.7V 2Mb / 4Mb / 8Mb (x16) MPF memories
performance
SST39VF200A / SST39VF400A / SST39VF800A
SST39LF200A / SST39LF400A / SST39LF800A
360
and
Word-Program,
SST39VF200A/400A/
the
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
• Fast Erase and Word-Program
• Automatic Write Timing
• End-of-Write Detection
• CMOS I/O Compatibility
• JEDEC Standard
• Packages Available
cantly improve performance and reliability, while lowering
power consumption. They inherently use less energy dur-
ing Erase and Program than alternative flash technologies.
When programming a flash device, the total energy con-
sumed is a function of the applied voltage, current, and
time of application. Since for any given voltage range, the
SuperFlash technology uses less current to program and
has a shorter erase time, the total energy consumed during
any Erase or Program operation is less than alternative
flash technologies. These devices also improve flexibility
while lowering the cost for program, data, and configuration
storage applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet surface mount requirements, the SST39LF200A/
400A/800A and SST39VF200A/400A/800A are offered in
both 48-lead TSOP packages and 48-ball TFBGA pack-
ages. See Figures 1 and 2 for pinouts.
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 70 ms (typical)
– Word-Program Time: 14 µs (typical)
– Chip Rewrite Time:
– Internal V
– Toggle Bit
– Data# Polling
– Flash EEPROM Pinouts and command sets
– 48-lead TSOP (12mm x 20mm)
– 48-ball TFBGA (6mm x 8mm)
2 seconds (typical) for SST39LF/VF200A
4 seconds (typical) for SST39LF/VF400A
8 seconds (typical) for SST39LF/VF800A
Multi-Purpose Flash and MPF are trademarks of Silicon Storage Technology, Inc.
PP
Generation
These specifications are subject to change without notice.
Data Sheet

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