M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 12

• Manufacturer Part Number: M393B1G70EM1
• Description: DDR3 SDRAM Memory
• Manufacturer: SAMSUNG [Samsung semiconductor]

Product Guide
6. Package Dimension
96Ball FBGA for 1Gb E-die (x16)
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
(Post Reflow ∅0.05 ± 0.05)
(Datum B)
(Post Reflow ∅0.05 ± 0.05)
(Datum A)
(Datum B)
(Datum A)
78 - ∅0.45 Solder ball
96 - ∅0.45 Solder ball
0.2
0.2
M
M
G
M
A
B
C
D
E
F
H
K
N
M
J
L
A
B
C
D
E
G
H
K
N
P
R
F
J
L
T
A B
A B
9
9
0.80
8 7 6 5 4 3 2 1
0.80 1.60
8 7 6 5 4 3 2 1
0.80 x 8 = 6.40
0.80 x 8 = 6.40
Bottom
7.50 ± 0.10
7.50 ± 0.10
Bottom
1.60
(1.90)
(1.90)
(0.95)
(0.95)
3.20
3.20
MOLDING AREA
MOLDING AREA
A
A
#A1 INDEX MARK
#A1 INDEX MARK
B
B
- 12 -
#A1
#A1
7.50 ± 0.10
7.50 ± 0.10
Top
Top
DDR3 SDRAM Memory
1.10 ± 0.10
1.10 ± 0.10
May. 2010
0.35 ± 0.05
0.35 ± 0.05