M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 2

• Manufacturer Part Number: M393B1G70EM1
• Description: DDR3 SDRAM Memory
• Manufacturer: SAMSUNG [Samsung semiconductor]

Product Guide
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
4. Density
5. Bit Organization
6. # of Internal Banks
51 : 512Mb
1G :
2G :
4G :
04 : x 4
08 : x 8
16 : x16
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
B : DDR3 SDRAM
1Gb
2Gb
4Gb
K 4 B X X X X X X X - X X X X
1
2
3
4
5
- 2 -
6
7. Interface ( V
8. Revision
9. Package Type
10. Temp & Power
11. Speed
C
L
Y
F7
F8
H9
K0
6 : SSTL (1.5V, 1.5V)
M
A
B
C
D
E
F
G
H
Z
H
J
M
7
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen
: 8th Gen
: 9th Gen
: FBGA (Lead-free)
: FBGA (Halogen-free & Lead-free)
: FBGA (Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, DDP)
: DDR3-800
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
8
DD
, V
9
DDQ
DDR3 SDRAM Memory
(400MHz @ CL=6, tRCD=6, tRP=6)
)
10
11
Interface (V
# of Internal Banks
Temp & Power
Package Type
DD
Revision
, V
Speed
May. 2010
DDQ
)