MASW-008902-000DIE MA-COM [M/A-COM Technology Solutions, Inc.], MASW-008902-000DIE Datasheet

MASW-008902-000DIE

Manufacturer Part Number

MASW-008902-000DIE

Description

Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.MASW-008902-000DIE.pdf (5 pages)

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Features

• 802.11b/g and Bluetooth Applications

• Insertion Loss: 0.60 dB typical

• Isolation:

• Flip-chip configuration

• RoHS* Compliant

Description

M/A-COM’s MASW-008902-000DIE is a bumped

single band GaAs pHEMT MMIC SP3T switch.

Typical applications are for single band 2.4 GHz

WLAN (802.11 b/g) and Bluetooth applications.

The MASW-008902-000DIE delivers high isolation,

low insertion loss, and high linearity at 2.4 - 2.5 GHz.

The MASW-008902-000DIE is fabricated using a 0.5

micron gate length GaAs pHEMT process.

process features full passivation for performance

and reliability. This die features SnAg (2.5%) solder

bumps for WLCSP applications.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Bumped GaAs SP3T Switch for WLAN

2.4 - 2.5 GHz

1. Die quantity varies.

2. Die on Grip Ring not available with orientation mark.

MASW-008902-000DIE

Ordering Information

Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

MASW-008902-001SMB

MASW-008902-000D3K

MASW-008902-000DIE

Part Number

31 dB typical (R

22 dB typical (T

Separated Die on Grip Ring

/ BT paths)

Path)

1,2

Die in 3000 piece reel

Sample Board SP3T

Package

The

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3. Exceeding any one or combination of these limits may cause

4. M/A-COM does not recommend sustained operation near

Die Bump Pad Layout (bump side up)

Absolute Maximum Ratings

Die Bump Pad Configuration

Input Power @ 3 V Control

Input Power @ 5 V Control

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

permanent damage to this device.

these survivability limits.

Operating Temperature

Visit www.macomtech.com for additional data sheets and product information.

Storage Temperature

Operating Voltage

Parameter

Name

GND

RFC

Blue Tooth T

Absolute Maximum

Voltage Control 1

Voltage Control 3

Voltage Control 2

2.5 GHz T

2.5 GHz R

Description

Antenna Port

-65°C to +150°C

-40°C to +85°C

Ground

+32 dBm

+35 dBm

+8 volts

3,4

Port

Rev. V3

Related parts for MASW-008902-000DIE

MASW-008902-000DIE Summary of contents

Page 1

... Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications. The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. The MASW-008902-000DIE is fabricated using a 0.5 micron gate length GaAs pHEMT process. process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for WLCSP applications ...

Page 2

... MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Electrical Specifications Parameter Insertion Loss Isolation Return Loss IP3 Input P1dB Harmonics Switching Speed Control Current 5. External blocking capacitors on all RF ports. Recommended PCB Configuration Parts List Part Value ...

Page 3

... MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Product Consistency Distribution Charts ...

Page 4

... MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Typical Performance Curves (plots = chip on board assembly) T Insertion Loss X 0.85 0.80 0.75 0.70 0.65 2.40 2.42 2.44 2.46 Frequency (GHz) R Insertion Loss X 0.85 0.80 0.75 0.70 0.65 2.40 2.42 2.44 2.46 Frequency (GHz) BT Insertion Loss 0.85 0.80 0.75 0.70 0.65 2.40 2.42 2.44 2.46 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...

Page 5

... MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Die Dimensions (Top and Side Views) Die Bump Pad Layout - Top View (bump side up) 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...

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