MASW-008902-000DIE_V4 MA-COM [M/A-COM Technology Solutions, Inc.], MASW-008902-000DIE_V4 Datasheet

MASW-008902-000DIE_V4

Manufacturer Part Number

MASW-008902-000DIE_V4

Description

Bumped GaAs SP3T Switch for WLAN

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.MASW-008902-000DIE_V4.pdf (5 pages)

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Bumped GaAs SP3T Switch for WLAN

2.4 - 2.5 GHz

Features

• 802.11b/g and Bluetooth Applications

• Insertion Loss: 0.60 dB typical

• Isolation:

• Flip-chip configuration

• RoHS* Compliant

Description

The MASW-008902-000DIE is a bumped single

band GaAs pHEMT MMIC SP3T switch. Typical

applications are for single band 2.4 GHz WLAN

(802.11 b/g) and Bluetooth applications.

The MASW-008902-000DIE delivers high isolation,

low insertion loss, and high linearity at 2.4 - 2.5 GHz.

The MASW-008902-000DIE is fabricated using a 0.5

micron gate length GaAs pHEMT process.

process features full passivation for performance

and reliability. This die features SnAg (2.5%) solder

bumps for WLCSP applications.

1. Die quantity varies.

2. Die on Grip Ring not available with orientation mark.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

MASW-008902-000DIE

Ordering Information

Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

MASW-008902-001SMB

MASW-008902-000D3K

MASW-008902-000DIE

Part Number

31 dB typical (R

22 dB typical (T

Separated Die on Grip Ring

/ BT paths)

Path)

1,2

Die in 3000 piece reel

Sample Board SP3T

Package

The

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3. Exceeding any one or combination of these limits may cause

4. M/A-COM Technology does not recommend sustained

Die Bump Pad Layout (bump side up)

Die Bump Pad Configuration

Absolute Maximum Ratings

Input Power @ 3 V Control

Input Power @ 5 V Control

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

permanent damage to this device.

operation near these survivability limits.

Operating Temperature

Visit www.macomtech.com for additional data sheets and product information.

Storage Temperature

Operating Voltage

Parameter

Name

GND

RFC

Blue Tooth T

• China Tel: +86.21.2407.1588

Voltage Control 1

Voltage Control 3

Voltage Control 2

Absolute Maximum

2.5 GHz R

2.5 GHz T

Description

Antenna Port

-65°C to +150°C

-40°C to +85°C

Ground

+32 dBm

+35 dBm

+8 volts

3,4

Port

Rev. V4

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