BR93L46RFVM-WTR Rohm Semiconductor, BR93L46RFVM-WTR Datasheet - Page 21

• Manufacturer Part Number: BR93L46RFVM-WTR
• Description: IC EEPROM 1KBIT 2MHZ 8MSOP
• Manufacturer: Rohm Semiconductor

Specifications of BR93L46RFVM-WTR

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (64 x 16)
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

●Note ofn use
© 2011 ROHM Co., Ltd. All rights reserved.
BR93L□□-W Series, 93A□□-WM Series, BR93H□□-WC Series
www.rohm.com
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(3) Absolute Maximum Ratings
(4) GND electric potential
(5) Heat design
(6) Terminal to terminal shortcircuit and wrong packaging
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in
consideration of static characteristics and transition characteristics and fluctuations of external parts and our IC.
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, IC
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear
exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to IC.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is not lower than that
of GND terminal in consideration of transition status.
In consideration of allowable loss in actual use condition, carry out heat design with sufficient margin.
When to package IC onto a board, pay sufficient attention to IC direction and displacement. Wrong packaging may
destruct IC. And in the case of shortcircuit between IC terminals and terminals and power source, terminal and GND
owing to foreign matter, IC may be destructed.
21/40
Technical Note
2011.02 - Rev.F