AT25128B-SSHL-B Atmel, AT25128B-SSHL-B Datasheet - Page 20

• Manufacturer Part Number: AT25128B-SSHL-B
• Description: IC EEPROM 128KBIT 20MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT25128B-SSHL-B

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 128K (16K x 8)
• Speed: 5MHz, 10MHz, 20MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Density: 128Kb
• Interface Type: Serial (SPI)
• Organization: 16Kx8
• Access Time (max): 80ns
• Frequency (max): 5MHz
• Write Protection: Yes
• Data Retention: 100Year
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Temp Range: -40C to 85C
• Supply Current: 10mA
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Memory Configuration: 16384 X 8
• Clock Frequency: 3MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

20
8A2 – TSSOP
AT25128B/256B
Notes: 1. This drawing is for general information only. Refer to
GND NC NC NC
SDA SCL NC V
[e-mail]
4
5
Package Drawing Contact:
Top View
Pin 1 indicator
2. Dimension
3. Dimension E1 does not include inter-lead Flash or
4. Dimension b does not include Dambar protrusion.
5. Dimension D and E1 to be determined at Datum
this corner
3
6
JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
protrusions or gate burrs. Mold Flash, protrusions and
gate burrs shall not
exceed 0.15 mm (0.006 in) per side.
protrusions. Inter-lead Flash and protrusions shall not
exceed 0.25 mm (0.010 in) per side.
Allowable Dambar protrusion shall be 0.08 mm total
in excess of the b dimension at maximum material
condition. Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion
and adjacent lead is 0.07 mm.
Plane H.
2
7
1
8
CC
D
E1
does
not
E
TITLE
8A2, 8-lead, 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
include
mold
End View
Flash,
L
L1
SYMBOL
D
E
E1
A
A2
b
e
L
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
2.90
4.30
0.80
0.19
0.45
MIN
–
Side View
GPC
6.40 BSC
0.65 BSC
1.00 RE3
TNR
NOM
3.00
4.40
1.00
0.60
D
b
–
–
DRAWING NO.
e
13.10
MAX
4.50
1.20
1.05
0.30
0.75
8A2
8698B–SEEPR–3/10
A2
NOTE
2, 5
3, 5
4
A
12/11/09
REV.
D