MT48LC16M8A2FB-75 IT:G TR Micron Technology Inc, MT48LC16M8A2FB-75 IT:G TR Datasheet - Page 65

IC SDRAM 128MBIT 133MHZ 60FBGA

MT48LC16M8A2FB-75 IT:G TR

Manufacturer Part Number
MT48LC16M8A2FB-75 IT:G TR
Description
IC SDRAM 128MBIT 133MHZ 60FBGA
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M8A2FB-75 IT:G TR

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (16M x 8)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
60-FBGA
Organization
16Mx8
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
557-1067-2
Figure 49:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
DQML, DQMH
COMMAND
A0–A9, A11
BA0, BA1
DQM /
CKE
CLK
A10
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
T0
ROW
ROW
BANK
WRITE – Without Auto Precharge
t CKH
t CMH
t AH
t AH
t AH
Notes:
t RCD
t RAS
t RC
t CK
T1
NOP
1. For this example, BL = 4, and the WRITE burst is followed by a “manual” PRECHARGE.
2. 15ns is required between <D
3. x16: A9 and A11 = “Don’t Care.”
DISABLE AUTO PRECHARGE
quency.
x8: A11 = “Don’t Care.”
t CMS
t CL
t DS
COLUMN m 3
WRITE
BANK
T2
D
IN
t CMH
t CH
t DH
m
t DS
D
T3
IN
NOP
m + 1
t DH
t DS
D
IN
T4
NOP
m + 2
t DH
65
IN
m + 3> and the PRECHARGE command, regardless of fre-
t DS
D
IN
T5
NOP
m + 3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t DH
t WR
NOP
T6
2
128Mb: x4, x8, x16 SDRAM
SINGLE BANK
PRECHARGE
ALL BANKS
BANK
T7
©1999 Micron Technology, Inc. All rights reserved.
Timing Diagrams
t RP
NOP
T8
ACTIVE
ROW
ROW
BANK
T9
DON’T CARE

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