MD4811-D512-V3Q18-P/Y SanDisk, MD4811-D512-V3Q18-P/Y Datasheet - Page 70

• Manufacturer Part Number: MD4811-D512-V3Q18-P/Y
• Description: IC MDOC G3 512MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD4811-D512-V3Q18-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1135

9.
9.1
A typical RISC processor memory architecture is shown in Figure 21. It may include the following
devices:
•
•
•
•
•
67
When used as a boot device, Mobile DiskOnChip G3 eliminates the need for a dedicated boot ROM/NOR device.
Mobile DiskOnChip G3: Contains the OS image, applications, registry entries, back-up
data, user files and data, etc. It can also be used to perform boot operation, thereby replacing
the need for a separate boot device.
CPU: Mobile DiskOnChip G3 is compatible with all major CPUs in the mobile market,
including:
o
o
o
o
o
o
o
Boot Device: ROM or NOR flash that contains the boot code required for system
initialization, kernel relocation, loading the operating systems and/or other applications and
files into the RAM and executing them.
RAM/DRAM Memory: This memory is used for code execution.
Other Devices: A DSP processor, for example, may be used in a RISC architecture for
enhanced multimedia support.
D
General Guidelines
ARM-based CPUs
Texas Instruments OMAP
Intel StrongARM SA-1100/1 and XScale
SuperH SH-3/4
Motorola PowerPC MPC8xx and DragonBall MX1
Philips PR31700
NEC VRSeries VR3/4xxxx
ESIGN
C
ONSIDERATIONS
Boot ROM or NOR
Fl
DiskOnChip G3
Boot Device
h
Mobile
Preliminary Data Sheet, Rev. 1.1
*
Other Devices
RAM/DRAM
CPU
Mobile DiskOnChip G3
91-SR-011-05-8L