MCP14700-E/MF Microchip Technology, MCP14700-E/MF Datasheet
MCP14700-E/MF
Specifications of MCP14700-E/MF
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MCP14700-E/MF Summary of contents
Page 1
... While the HIGHDR can sink 2A peak typically, the LOWDR can sink 3.5A peak typically. The low resistance pull-up and pull-down drive allow the MCP14700 to quickly transition a 3300 pF load in typically 10 ns. Bootstrapping for the high-side drive is internally implemented which allows for a reduced system cost and design complexity ...
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... GND AN0 CURRENT AN1 SENSE 24V 24V SENSE SENSE NODE NODE 24V V REF V = 30V BUCK CURRENT SENSE BOOT V CC HIGHDR V CC MCP14700 PWM5 PHASE PWM H PWM6 LOWDR PWM LO GND PWM1 PWM2 PWM3 PWM4 PWM5 PWM6 dsPIC © 2009 Microchip Technology Inc. ...
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... Functional Block Diagram V CC PWM HI Input Circuitry PWM LO GND V CC © 2009 Microchip Technology Inc. Level Shift Logic Protection Circuitry MCP14700 BOOT HIGHDR PHASE V CC LOWDR GND DS22201A-page 3 ...
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... MCP14700 NOTES: DS22201A-page 4 © 2009 Microchip Technology Inc. ...
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... MCP14700 Units Conditions V µA PWM and PWM pin HI LO floating V mV µ 3.0V PWM PWM 5.0V ...
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... MCP14700 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, V Parameters Sym Switching Times HIGHDR Rise Time t LOWDR Rise Time t HIGHDR Fall Time t LOWDR Fall Time HIGHDR Turn-off Propagation t PDLH Delay LOWDR Turn-off Propagation t PDLL Delay HIGHDR Turn-on Propagation t PDHH Delay LOWDR Turn-on Propagation ...
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... LOAD -40 -25 -10 FIGURE 2-5: vs. Temperature LOAD 22 t PDLH PDHH -40 -25 -10 FIGURE 2-6: vs. Temperature. MCP14700 1500 3000 4500 6000 7500 Capacitive Load (pF) Fall Time vs. Capacitive = 3,300 110 125 o Temperature ( C) LOWDR Rise and Fall Time = 3,300 pF t PDHL t PDLL 110 125 o Temperature ( C) LOWDR Propagation Delay ...
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... MCP14700 Note: Unless otherwise indicated +25°C with 3,300 pF LOAD 100 1000 Frequency (kHz) FIGURE 2-7: Supply Current vs. Frequency. DS22201A-page 8 = 5.0V 3,300 pF LOAD PWM = PWM = -40 -25 -10 5 10000 FIGURE 2-8: Temperature 110 125 Temperature (°C) Supply Current vs. © 2009 Microchip Technology Inc. ...
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... LOWDR pin to also LO transition high. 3.4 Ground (GND) The GND pin provides ground for the MCP14700 circuitry. It should have a low-impedance connection to the bias supply source return. High peak currents will flow out the GND pin when the low-side power MOSFET is being turned off. ...
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... MCP14700 NOTES: DS22201A-page 10 © 2009 Microchip Technology Inc. ...
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... PWM inputs have the proper timing. There is no internal cross conduction protection in the MCP14700. 4.3 Under Voltage Lockout (UVLO) The UVLO feature of the MCP14700 does not allow the HIGHDR or LOWDR output to function when the input voltage below the UVLO threshold regardless CC ...
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... MCP14700 PWM HI t PDHH HIGHDR t RH FIGURE 4-2: MCP14700 HIGHDR Timing Diagram. DS22201A-page 12 t PDLH t FH © 2009 Microchip Technology Inc. ...
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... Microchip Technology Inc. 5.3 Power Dissipation The power dissipated in the MCP14700 consists of the power loss associated with the quiescent power and the gate charge power. The quiescent power loss can be calculated by the following equation and is typically negligible compared to the gate drive power loss ...
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... There are two important states of the MCP14700 outputs, high and low. Figure 5-1 depicts the current flow paths when the outputs of the MCP14700 are high and the power MOSFETs are turned on. The charge needed to turn on the low-side power MOSFET comes from the decoupling capacitor C ...
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... Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( can be found on the outer packaging for this package. MCP14700 Example: DABR 0933 256 : ...
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... MCP14700 /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0) ± 1RWH 1RWHV DS22201A-page 16 PP %RG\ >')1@ © 2009 Microchip Technology Inc. ...
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... Microchip Technology Inc. MCP14700 PP %RG\ >')1@ DS22201A-page 17 ...
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... MCP14700 /HDG 3ODVWLF 6PDOO 2XWOLQH 61 ± 1DUURZ 1RWH 1RWHV DS22201A-page 18 PP %RG\ >62,&@ α φ β © 2009 Microchip Technology Inc. ...
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... Microchip Technology Inc. MCP14700 PP %RG\ >62,&@ DS22201A-page 19 ...
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... MCP14700 NOTES: DS22201A-page 20 © 2009 Microchip Technology Inc. ...
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... APPENDIX A: REVISION HISTORY Revision A (September 2009) • Original Release of this Document. © 2009 Microchip Technology Inc. MCP14700 DS22201A-page 21 ...
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... MCP14700 NOTES: DS22201A-page 22 © 2009 Microchip Technology Inc. ...
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... Package MF = Plastic Dual Flat, No Lead (3x3 DFN), 8-lead SN = Plastic Small Outline, (3.90 mm), 8-lead © 2009 Microchip Technology Inc. MCP14700 . Examples: a) MCP14700-E/MF: Extended Temperature, 8LD DFN package. b) MCP14700T-E/MF: Tape and Reel, Extended Temperature, 8LD DFN package. a) MCP14700-E/SN: Extended Temperature, 8LD SOIC package ...
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... MCP14700 NOTES: DS22201A-page 24 © 2009 Microchip Technology Inc. ...
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... REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2009 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...