MCP14700-E/MF Microchip Technology, MCP14700-E/MF Datasheet - Page 14

• Manufacturer Part Number: MCP14700-E/MF
• Description: IC MOSFET DRIVER HIGH/LOW 8DFN
• Manufacturer: Microchip Technology
• Type: High and Low Side Gate Driverr

Specifications of MCP14700-E/MF

• Package / Case: 8-DFN
• Configuration: High and Low Side, Synchronous
• Input Type: Non-Inverting
• Delay Time: 27ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 36V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Product: MOSFET Gate Drivers
• Rise Time: 10 ns
• Fall Time: 10 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 80 uA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 36 ns
• Maximum Turn-on Delay Time: 36 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: Single
• Output Current: 2000 mA
• Output Voltage: 0.025 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP14700
5.4
Proper PCB layout is important in a high current, fast
switching circuit to provide proper device operation.
Improper component placement may cause errant
switching, excessive voltage ringing, or circuit latch-up.
There are two important states of the MCP14700
outputs, high and low.
flow paths when the outputs of the MCP14700 are high
and the power MOSFETs are turned on. The charge
needed to turn on the low-side power MOSFET comes
from the decoupling capacitor C
from this capacitor through the internal LOWDR
circuitry, into the gate of the low-side power MOSFET,
out the source, into the ground plane, and back to
C
the inductance and area of this current loop must be
minimized.
FIGURE 5-1:
The charge needed to turn on the high-side power
MOSFET comes from the bootstrap capacitor C
Current flows from C
HIGHDR circuitry, into the gate of the high-side power
MOSFET, out the source and back to C
printed circuit board traces that construct this current
loop need to have a small area and low inductance. To
control the inductance, short and wide traces must be
used.
DS22201A-page 14
VCC
PWM
PWM
V
C
CC
VCC
. To reduce any excess voltage ringing or spiking,
HI
LO
PCB Layout
MCP14700
Turn On Current Paths.
C
Figure 5-1
BOOT
BOOT
VCC
through the internal
depicts the current
. The current flows
V
BOOT
SUPPLY
. The
BOOT
.
Figure 5-2
outputs of the MCP14700 are low and the power
MOSFETs are turned off. These current paths should
also have low inductance and a small loop area to
minimize the voltage ringing and spiking.
FIGURE 5-2:
The following recommendations should be followed for
optimal circuit performance:
- The components that construct the high
- A ground plane should be used to keep both
PWM
PWM
V
C
CC
current paths previously mentioned should be
placed close the MCP14700 device. The
traces used to construct these current loops
should be wide and short to keep the
inductance and impedance low.
the parasitic inductance and impedance
minimized. The MCP14700 device is capable
of sourcing and sinking high peaks current
and any extra parasitic inductance or
impedance will result in non-optimal
performance.
VCC
HI
LO
depicts the current flow paths when the
MCP14700
Turn Off Current Paths.
C
© 2009 Microchip Technology Inc.
BOOT
V
SUPPLY