MCP14700-E/MF Microchip Technology, MCP14700-E/MF Datasheet - Page 9

• Manufacturer Part Number: MCP14700-E/MF
• Description: IC MOSFET DRIVER HIGH/LOW 8DFN
• Manufacturer: Microchip Technology
• Type: High and Low Side Gate Driverr

Specifications of MCP14700-E/MF

• Package / Case: 8-DFN
• Configuration: High and Low Side, Synchronous
• Input Type: Non-Inverting
• Delay Time: 27ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 36V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Product: MOSFET Gate Drivers
• Rise Time: 10 ns
• Fall Time: 10 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 80 uA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 36 ns
• Maximum Turn-on Delay Time: 36 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: Single
• Output Current: 2000 mA
• Output Voltage: 0.025 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
The PHASE pin provides a return path for the high-side
gate driver. The source of the high-side and the drain of
the low-side power MOSFETs are connected to this
pin.
3.2
The PWM input signal to control the high-side power
MOSFET is applied to the PWM
the PWM
transition high.
3.3
The PWM input signal to control the low-side power
MOSFET is applied to the PWM
the PWM
transition high.
3.4
The GND pin provides ground for the MCP14700
circuitry. It should have a low-impedance connection to
the bias supply source return. High peak currents will
flow out the GND pin when the low-side power
MOSFET is being turned off.
3.5
The LOWDR pin provides the gate drive signal to
control the low-side power MOSFET. The gate of the
low-side power MOSFET is connected to this pin.
© 2009 Microchip Technology Inc.
3x3 DFN
1
2
3
4
5
6
7
8
9
PIN DESCRIPTIONS
Switch Node (PHASE)
High-Side PWM Control Input
Signal (PWM
Low-Side PWM Control Input
Signal (PWM
Ground (GND)
Low-side Gate Drive (LOWDR)
HI
LO
MCP14700
pin causes the HIGHDR pin to also
pin causes the LOWDR pin to also
PIN FUNCTION TABLE
SOIC
HI
LO
—
1
2
3
4
5
6
7
8
)
)
LO
HI
pin. A logic high on
pin. A logic high on
Table
HIGHDR
LOWDR
Symbol
PWM
PHASE
PWM
BOOT
GND
V
EP
CC
3-1.
LO
HI
Switch Node
High-Side PWM Control Input Signal
Low-Side PWM Control Input Signal
Ground
Low-side Gate Drive
Supply Input Voltage
Floating Bootstrap Supply
High-Side Gate Drive
Exposed Metal Pad
3.6
The V
bypass capacitor is to be placed between this pin and
the GND pin. This capacitor should be placed as close
to the MCP14700 as possible.
3.7
The BOOT pin is the floating bootstrap supply pin for
the high-side gate drive. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side power
MOSFET.
3.8
The HIGHDR pin provides the gate drive signal to
control the high-side power MOSFET. The gate of the
high-side power MOSFET is connected to this pin.
3.9
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
CC
Supply Input Voltage (V
Floating Bootstrap Supply (BOOT)
High-Side Gate Drive (HIGHDR)
Exposed Metal Pad (EP)
pin provides bias to the MCP14700 device. A
Description
MCP14700
DS22201A-page 9
CC
)