IR3088AMTRPBF International Rectifier, IR3088AMTRPBF Datasheet

IC XPHASE W/FAULT DET 20L-MLPQ

IR3088AMTRPBF

Manufacturer Part Number
IR3088AMTRPBF
Description
IC XPHASE W/FAULT DET 20L-MLPQ
Manufacturer
International Rectifier
Series
XPhase™r
Datasheet

Specifications of IR3088AMTRPBF

Applications
Processor
Current - Supply
10mA
Voltage - Supply
8.4 V ~ 14 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Pin Count
20
Mounting
Surface Mount
Package Type
MLPQ
Case Length
4mm
Case Height
0.88mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3088AMTRPBF
IR3088AMTRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR3088AMTRPBF
Manufacturer:
IR
Quantity:
20 000
DESCRIPTION
FEATURES
APPLICATION CIRCUIT
Page 1 of 33
The IR3088A Phase IC combined with an IR XPhase
implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides
overall system control and interfaces with any number of “Phase” ICs which each drive and monitor a single
phase of a multiphase converter. The XPhase
expensive, and easier to design while providing higher efficiency than conventional approaches.
The IR3088A is intended for the following application conditions;
5 Wire Analog Bus
From Control IC
Excessive impedance between converter and load
Output voltage exceeding the control IC reference/VID voltage is desired
2.5A Average Gate Drive Current
Loss-Less Inductor Current Sense
Internal Inductor DCR Temperature Compensation
Programmable Phase Delay
Programmable Feed-Forward Voltage Mode PWM Ramp
Sub 100ns Minimum Pulse Width supports 1MHz per-phase operation
Current Sense Amplifier drives a single wire Average Current Share Bus
Current Share Amplifier reduces PWM Ramp slope to ensure sharing between phases
Body Braking
output voltage at converter turn-off
Phase Fault Detection
Programmable Phase Over-Temperature Detection
Control FET driver’s 25V input voltage capability simplifies boot-strap supply design
Small thermally enhanced 20L MLPQ package
PHASE FAULT
XPHASE
TM
VGATE
VRHOT
ISHARE
DAC
BIAS
RAMP
disables Synchronous MOSFET for improved transient response and prevents negative
12V
EA
TM
PHASE IC WITH FAULT AND OVERTEMP DETECT
RBIASIN
1
2
3
4
5
CSCOMP
RMPIN+
RMPIN-
HOTSET
VRHOT
ISHARE
20k
TM
IR3088A
PHASE
IC
architecture results in a power supply that is smaller, less
TM
Control IC provides a full featured and flexible way to
RCS-
CCS-
CVCC
GATEH
GATEL
VCCH
PGND
VCCL
RVCC
RPWMRMP
15
14
13
12
11
DBST
CVCCL
CCS+
RCS+
CBST
L
CO
IR3088APbF
May 18, 2009
DATA SHEET
CIN
VO

Related parts for IR3088AMTRPBF

IR3088AMTRPBF Summary of contents

Page 1

XPHASE DESCRIPTION The IR3088A Phase IC combined with an IR XPhase implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides overall system control and interfaces with any number of “Phase” ICs which each drive ...

Page 2

ORDERING INFORMATION Device IR3088AMTR * IR3088AM * Samples only ABSOLUTE MAXIMUM RATINGS Operating Junction Temperature……………..150 Storage Temperature Range………………….-65 ESD Rating………………………………………HBM Class 1C JEDEC standard PIN # PIN NAME 1 RMPIN+ 2 RMPIN- 3 HOTSET 4 VRHOT 5 ISHARE 6 SCOMP ...

Page 3

ELECTRICAL SPECIFICATIONS Unless otherwise specified, these specifications apply over: 8.4V ≤ ≤ 14V ≤ T ≤ 125 PARAMETER Gate Drivers GATEH Rise Time GATEH Fall Time GATEL Rise Time GATEL Fall Time ...

Page 4

PARAMETER Ramp Comparator Input Offset Voltage Hysteresis RMPIN+, RMPIN- Bias Current Propagation Delay PWM Comparator PWM Comparator Input Offset Voltage EAIN & PWMRMP Bias Current Propagation Delay Common Mode Input Range Share Adjust Error Amplifier Input Offset Voltage Input Voltage ...

Page 5

PARAMETER General VCC Supply Current VCCL Supply Current VCCH Supply Current BIASIN Bias Current DACIN Bias Current Note 1: Guaranteed by design, but not tested in production PIN DESCRIPTION PIN# PIN SYMBOL PIN DESCRIPTION 1 RMPIN+ Non-inverting input to Ramp ...

Page 6

SYSTEM THEORY OF OPERATION TM XPhase Architecture TM The XPhase architecture is designed for multiphase interleaved buck converters which are used in applications requiring small size, design flexibility, low voltage, high current and fast transient response. The architecture can control ...

Page 7

PWM Control Method The PWM block diagram of the XPhase trailing edge modulation is used. A high-gain wide-bandwidth voltage type error amplifier in the Control IC is used for the voltage control loop. An external RC circuit connected to the ...

Page 8

VPEAK (5.0V) VPHASE4&5 (4.5V) VPHASE3&6 (3.5V) VPHASE2&7 (2.5V) VPHASE1&8 (1.5V) VVALLEY (1.00V) PWM Operation The PWM comparator is located in the Phase IC. Upon receiving a clock pulse, the PWM latch is set; the PWMRMP voltage begins to increase; the ...

Page 9

PHASE IC CLOCK PULSE EAIN PWMRMP VDAC GATEH GATEL STEADY-STATE OPERATION TM Body Braking In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load step decrease is; The ...

Page 10

Figure 5. Inductor Current Sensing and Current Sense Amplifier The advantage of sensing the inductor current versus high side or low side sensing is that actual output current being delivered to the load is obtained rather than peak or sampled ...

Page 11

IR3088A THEORY OF OPERATION Block Diagram The Block diagram of the IR3088A is shown in figure 6, and specific features are discussed in the following sections. RAMP COMPARATOR RMPIN+ CLOCK + PULSE RMPIN- - GENERATOR EAIN SYSTEM BIASIN REFERENCE VOLTAGE ...

Page 12

Phase Fault It is possible for multiphase converters to appear to be working correctly with one or more phases not functioning. The output voltage can still be regulated and the full load current may still be delivered. However, the remaining ...

Page 13

VGATE RVCC QGATE 10 ohm DGATE CVCC RGATE 0.1uF ENABLE CFB 0.1uF RBBFB RFB1 RFB 1 21 OSCDS VBIAS RBBDRP 2 20 VID5 VID5 BBFB VID0 3 IR3081A 19 VID0 EAOUT CCP RCP VID1 4 CONTROL 18 VID1 FB ...

Page 14

DESIGN PROCEDURES - IR3081A AND IR3088A CHIPSET IR3081A EXTERNAL COMPONENTS Oscillator Resistor Rosc The oscillator of IR3081A generates a triangle waveform to synchronize the phase ICs, and the switching frequency of the each phase converter equals the oscillator frequency, which ...

Page 15

Over Current Setting Resistor R The inductor DC resistance is utilized to sense the inductor current. The copper wire of inductor has a constant temperature coefficient of 3850 ppm/° C, and therefore the maximum inductor DCR can be calculated from ...

Page 16

IR3088A EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C PWMRMP PWM ramp is generated by connecting the resistor R as the capacitor C between PWMRMP and LGND. Choose the desired PWM ramp magnitude V PWMRMP the capacitor C in ...

Page 17

Phase Delay Timing Resistors R The phase delay of the interleaved multiphase converter is programmed by the resistor divider connected at RMPIN+ or RMPIN- depending on which slope of the oscillator ramp is used for the phase delay programming of ...

Page 18

VOLTAGE LOOP COMPENSATION The adaptive voltage positioning (AVP) is usually adopted in the computer applications to improve the transient response and reduce the power loss at heavy load. Like current mode control, the adaptive voltage positioning loop introduces extra zero ...

Page 19

C 1 π ∗ E θ − A tan Choose the desired crossover frequency fc around fc1 estimated by Equation (27) or choose fc between 1/10 and 1/5 of the switching ...

Page 20

CURRENT SHARE LOOP COMPENSATION The crossover frequency of the current share loop should be at least one decade lower than that of the voltage loop in order to eliminate the interaction between the two loops. A capacitor from SCOMP to ...

Page 21

DESIGN EXAMPLE 1 - VRM 10 2U CONVERTER SPECIFICATIONS Input Voltage DAC Voltage: V =1.35 V DAC No Load Output Voltage Offset: V Output Current: I =105 ADC O Maximum Output Current: I =120 ADC OMAX ...

Page 22

VDAC Slew Rate Programming Capacitor C From Figure 15 of IR3081A Data Sheet, the sink current of VDAC pin corresponding to 400kHz (R 76uA. Calculate the VDAC down-slope slew-rate programming capacitor from the required down-slope slew rate. − ...

Page 23

Body Braking Related Resistors R N/A. The body braking during Dynamic VID is disabled. IR3088A EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C PWMRMP Set PWM ramp magnitude V PWMRMP resistor R , PWMRMP R = PWMRMP V ∗ ...

Page 24

Bootstrap Capacitor C BST Choose C =0.1uF BST Decoupling Capacitors for Phase IC and Power Stage Choose C =0.1uF, C =0.1uF VCC VCCL VOLTAGE LOOP COMPENSATION Type II compensation is used for the converter with AL-Polymer output capacitors. Choose the ...

Page 25

DESIGN EXAMPLE 2 - EVRD 10 HIGH FREQUENCY ALL-CERAMIC CONVERTER SPECIFICATIONS Input Voltage DAC Voltage: V =1.3 V DAC No Load Output Voltage Offset: V Output Current: I =105 ADC O Maximum Output Current: I =120 ...

Page 26

I 170 * 10 SINK VDAC − 3 − DOWN Calculate the programming resistor. − ...

Page 27

IR3088A EXTERNAL COMPONENTS PWM Ramp Resistor R and Capacitor C PWMRMP Set PWM ramp magnitude V PWMRMP resistor R , PWMRMP R = PWMRMP [ln PWMRMP = 3 − ∗ ...

Page 28

R =10k , R =768 , R PHASE41 PHASE42 Bootstrap Capacitor C BST Choose C =0.1uF BST Decoupling Capacitors for Phase IC and Power Stage Choose C =0.1uF, C =0.1uF VCC VCCL VOLTAGE LOOP COMPENSATION Type III compensation is used ...

Page 29

LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout, therefore minimizing the noise coupled to the IC. • Dedicate at least one middle layer for a ground plane, which is ...

Page 30

PCB Metal and Component Placement • Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting. • Lead land length should be equal to maximum part ...

Page 31

Solder Resist • The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands ...

Page 32

Stencil Design • The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 33

PACKAGE INFORMATION 20L MLPQ ( Body) – θ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 Visit us at www.irf.com for sales contact information. Page ...

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