IR3510MTRPBF International Rectifier, IR3510MTRPBF Datasheet - Page 33

• Manufacturer Part Number: IR3510MTRPBF
• Description: IC XPHASE CONTROL 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3510MTRPBF

• Applications: Processor
• Mounting Type: Surface Mount
• Package / Case: 32-MLPQ
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Other names: IR3510MTRPBFTR

PCB METAL AND COMPONENT PLACEMENT
• Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥
• Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm inboard
• Center pad land length and width should be equal to maximum part pad length and width. However, the minimum
• Four 0.3mm diameter vias shall be placed in the pad land spaced at 1.2mm, and connected to ground to minimize
• No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so can cause
0.2mm to minimize shorting.
extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will
accommodate any part misalignment and ensure a fillet.
metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper ( ≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for 3 oz.
Copper)
the noise effect on the IC and to transfer heat to the PCB.
the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
Page 33 of 36
IR Confidential
May 18, 2009
IR3510