LTC3727EG-1#TR Linear Technology, LTC3727EG-1#TR Datasheet - Page 31

• Manufacturer Part Number: LTC3727EG-1#TR
• Description: IC REG SW SYNC 2PH STPDWN 28SSOP
• Manufacturer: Linear Technology
• Series: PolyPhase®r
• Type: Step-Down (Buck)r

Specifications of LTC3727EG-1#TR

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 14 V
• Current - Output: 25A
• Frequency - Switching: 250kHz ~ 550kHz
• Voltage - Input: 4 ~ 36 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -

PACKAGE DESCRIPTIO
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
**
(.0035 – .010)
*
0.09 – 0.25
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
5.50 ±0.05
4.10 ±0.05
(.197 – .221)
(4 SIDES)
5.00 – 5.60**
3.50 REF
(.022 – .037)
MILLIMETERS
0.55 – 0.95
(INCHES)
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.45 ± 0.05
0° – 8°
5.00 ± 0.10
3.45 ± 0.05
(4 SIDES)
U
(.0256)
7.8 – 8.2
0.65
BSC
0.42 ±0.03
(Reference LTC DWG # 05-08-1693 Rev D)
0.50 BSC
32-Lead Plastic QFN (5mm × 5mm)
0.25 ± 0.05
(.009 – .015)
(Reference LTC DWG # 05-08-1640)
0.22 – 0.38
28-Lead Plastic SSOP (5.3mm)
RECOMMENDED SOLDER PAD LAYOUT
TYP
0.70 ±0.05
PACKAGE OUTLINE
UH Package
G Package
0.75 ± 0.05
0.65 BSC
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(4-SIDES)
3.50 REF
0.00 – 0.05
0.200 REF
R = 0.05
G28 SSOP 0204
TYP
1.25 ±0.12
5.3 – 5.7
(.002)
0.05
MIN
(.079)
MAX
2.0
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 ± 0.10
LTC3727/LTC3727-1
TYP
28
1 2 3 4 5 6 7 8 9 10 11 12
3.45 ± 0.10
27
26
25
24
9.90 – 10.50*
31
(.390 – .413)
23
0.50 BSC
0.25 ± 0.05
22 21 20 19 18 17 16 15
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 ± 0.10
13
14
(.291 – .323)
7.40 – 8.20
31
3727fc