LM5118Q1MH/NOPB National Semiconductor, LM5118Q1MH/NOPB Datasheet - Page 3

• Manufacturer Part Number: LM5118Q1MH/NOPB
• Description: IC BUCK BST ADJ 20TSSOP
• Manufacturer: National Semiconductor
• Series: PowerWise®r
• Type: Step-Down (Buck), Step-Up (Boost)r

Specifications of LM5118Q1MH/NOPB

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 1.23 ~ 70 V
• Frequency - Switching: 200kHz, 515kHz
• Voltage - Input: 3 ~ 75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Power - Output: -
• Other names: *LM5118Q1MH/NOPB; LM5118Q1MH

Pin
11
12
13
14
15
16
17
18
19
20
PGND
SYNC
VCCX
Name
CSG
VCC
HO
CS
HB
HS
LO
EP
Description
Sync input for switching regulator synchronization to an external clock.
Current sense input. Connect to the diode side of the current sense resistor.
Current sense ground input. Connect to the ground side of the current sense resistor.
Power Ground.
Boost MOSFET gate drive output. Connect to the gate of the external boost MOSFET.
Output of the bias regulator. Locally decouple to PGND using a low ESR/ESL capacitor located as close to
the controller as possible.
Optional input for an externally supplied bias supply. If the voltage at the VCCX pin is greater than 3.9V, the
internal VCC regulator is disabled and the VCC pin is internally connected to VCCX pin supply. If VCCX is not
used, connect to AGND.
High side gate driver supply used in bootstrap operation. The bootstrap capacitor supplies current to charge
the high side MOSFET gate. This capacitor should be placed as close to the controller as possible and
connected between HB and HS.
Buck MOSFET gate drive output. Connect to the gate of the high side buck MOSFET through a short, low
inductance path.
Buck MOSFET source pin. Connect to the source terminal of the high side buck MOSFET and the bootstrap
capacitor.
Solder to the ground plane under the IC to aid in heat dissipation.
3
www.national.com