HCPL-0723-000E Avago Technologies US Inc., HCPL-0723-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-0723-000E
• Description: OPTOCOUPLER CMOS 50MBD 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0723-000E

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 10mA
• Data Rate: 50MBd
• Propagation Delay High - Low @ If: 16ns
• Input Type: Logic
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 10 mA
• Maximum Fall Time: 0.006 us
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 50 MBd(Min)
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 10µA
• Output Voltage: 5V
• Opto Case Style: SOIC
• No. Of Pins: 8
• Common Mode Ratio: 10000
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1640-5

Solder Reflow Temperature Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
5
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
Symbol
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
7723
7.1
7.4
0.08
≥ 175
IIIa
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
Value
150
0723
4.9
4.8
0.08
≥ 175
IIIa
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
Units
mm
mm
mm
Volts
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
250
Regulatory Information
The HCPL-7723/0723 have been
approved by the following organi-
zations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997+A1:2002/
EN 60747-5-2:2001+A1:2002/
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2): 2003-01.