PC929PYJ000F Sharp Microelectronics, PC929PYJ000F Datasheet
PC929PYJ000F
Specifications of PC929PYJ000F
Related parts for PC929PYJ000F
PC929PYJ000F Summary of contents
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PC929J00000F Series ■ Description PC929J00000F Series contains an IRED optically coupled to an OPIC chip packaged in a Mini-flat, Half pitch type (14 pin). Input-output isolation voltage(rms) is 4.0kV. High speed responce ( MAX. 0.5 ...
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... CC ∗ NC GND output High level Low level At operating protection function High level High level 2. SMT Gullwing Lead-Form (VDE option) [ex. PC929PYJ000F] ±0.25 1.27 SHARP mark "S" ±0.3 7.62 Epoxy resin +0.4 +0.4 1.0 1.0 −0 −0 +0 10.0 −0.5 Product mass : approx. 0.47g ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings (unless otherwise specified T Parameter Symbol *1 Forward current Reverse voltage V R Supply voltage output current peak output current I 1 O1P O output ...
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Parameter *11 "Low→High" input threshold current Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) *12 Overcurrent detection voltage ...
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... Package 50pcs/sleeve DIN EN60747-5-2 −−−−−− Model No. PC929J00000F PC929YJ0000F Please contact a local SHARP sales representative to inquire about production status. SMT Gullwing Taping 1 000pcs/reel Approved −−−−−− Approved PC929PJ0000F PC929PYJ000F 6 PC929J00000F Series Sheet No.: D2-A06302EN ...
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Fig.1 Test Circuit for O Low Level Output 1 Voltage Fig.3 Test Circuit for O Low Level Output 2 Voltage ...
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Fig.7 Test Circuit for Instantaneous Common Mode Rejection Voltage − waveform waveform ...
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Fig.11 Test Circuit for O Low Level 1 Error Signal Voltage FSL 8 Fig.13 Test Circuit for O "High→Low" Propagation 2 Delay Time at Overcurrent Protection, ...
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Fig.15 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.17 Forward Current vs. Forward Voltage 100 25˚C 50˚C 70˚C 0.1 0.01 1.0 1.2 1.4 1.6 Forward ...
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Fig.21 O Low Level Output Voltage vs. 1 Ambient Temperature 0.2 0.15 0.1 I =0.1A O1 0.05 0 − Ambient temperature T Fig.23 O High Level Output Voltage vs. 2 Supply Voltage ...
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Fig.27 High Level Supply Current vs. Supply Voltage 16 T =−25˚ =25˚ =80˚ Supply voltage V Fig.29 Propagation Delay Time vs. Forward Current 1 t ...
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Fig.33 Error Signal "High-Low" Propagation Delay Time vs. Ambient Temperature 1.5 1.2 0.9 0.6 0.3 0 − Ambient temperature T Fig.35 Low Level Error Signal Voltage vs. Ambient Temperature 0.5 =24V =5mA F I ...
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Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test Circuit V Anode Cathode GND Fig.40 Example of The Application Circuit (IGBT Drive ...
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Fig.41 Operations of Shortcircuit Protector Circuit Anode 3 Cathode 1 Cathode 2 TTL, micro computer, etc. 1. Detection of increase in V CE(sat) 2. Reduction of the IGBT gate voltage, and suppression of the collector current 3. Simultaneous output of ...
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Design Considerations ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid ...
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Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
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Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...