PC817XJ0000F Sharp Microelectronics, PC817XJ0000F Datasheet - Page 10

• Manufacturer Part Number: PC817XJ0000F
• Description: PHOTOCOUPLER TRAN OUT 4-DIP
• Manufacturer: Sharp Microelectronics

Specifications of PC817XJ0000F

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 5000Vrms
• Current Transfer Ratio (min): 50% @ 5mA
• Current Transfer Ratio (max): 600% @ 5mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 200mV
• Output Type: Transistor
• Mounting Type: Through Hole
• Package / Case: 4-DIP
• Configuration: 1
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 200 mV
• Isolation Voltage: 5000 Vrms
• Current Transfer Ratio: 600 %
• Maximum Forward Diode Voltage: 1.4 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 30 C
• Forward Current: 5 mA
• Maximum Fall Time: 18 us
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 6 V
• Maximum Rise Time: 18 us
• Output Device: Transistor
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 425-2427-5

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
PC817XJ0000F Series
(min)
Sheet No.: D2-A03102EN