LTL42EKEKNN Lite-On Electronics, LTL42EKEKNN Datasheet - Page 7

LED 3MM 632NM ALINGAP RED CLEAR

LTL42EKEKNN

Manufacturer Part Number
LTL42EKEKNN
Description
LED 3MM 632NM ALINGAP RED CLEAR
Manufacturer
Lite-On Electronics
Type
Uni-Colorr
Datasheet

Specifications of LTL42EKEKNN

Led Size
T-1
Illumination Color
Red
Lens Color/style
Water Clear
Operating Voltage
2.05 V
Wavelength
632 nm
Luminous Intensity
880 mcd
Mounting Style
Through Hole
Viewing Angle
22°
Package / Case
Radial - 2 Lead
Color
Red
Millicandela Rating
880mcd
Current - Test
20mA
Wavelength - Dominant
624nm
Wavelength - Peak
632nm
Voltage - Forward (vf) Typ
2.05V
Lens Type
Clear
Lens Style/size
Round, 3mm, T-1
Height
5.25mm
Mounting Type
Through Hole
Resistance Tolerance
624nm
Package Type
T-1
Emitting Color
Red
Test Current (it)
20mA
Forward Current
30mA
Dominant Wave Length
624nm
Forward Voltage
2.4V
Product Length (mm)
4mm
Product Height (mm)
5.25mm
Product Depth (mm)
4mm
Mounting
Through Hole
Peak Wavelength
632nm
Shape Type
Circular
Chip Material
AlGaInP
Main Category
Standard LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
5V
Power Dissipation
75mW
Lens Dimensions
3X3X4.25mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
160-1665

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTL42EKEKNN
Manufacturer:
LITEON
Quantity:
40 000
1. Application
2. Storage
3. Cleaning
4. Lead Forming & Assembly
5. Soldering
Part No. : LTL42EKEKNN
BNS-OD-C131/A4
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
Recommended soldering conditions :
Temperature
Soldering time
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
Soldering iron
LITE-ON TECHNOLOGY CORPORATION
300°C Max.
3 sec. Max.
(one time only)
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
Pre-heat
Pre-heat time
Solder wave
Soldering time
Wave soldering
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
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