JW050F6 Lineage Power, JW050F6 Datasheet - Page 16

• Manufacturer Part Number: JW050F6
• Description: CONVERTER DC/DC 3.3V 33W OUT
• Manufacturer: Lineage Power
• Series: JW050r
• Type: Isolated with Remote On/Offr

Specifications of JW050F6

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 33W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 3.3 VDC @ 10A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 33W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 80%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 99 W
Thermal Considerations
Custom Heat Sinks
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
16
16
θ
sa
=
(
------------------------ -
T
C
P
–
D
T
A
)
–
θ
cs
(continued)
(continued)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
Lineage Power
April 2008