JAHW075Y1 Lineage Power, JAHW075Y1 Datasheet - Page 14

• Manufacturer Part Number: JAHW075Y1
• Description: CONVERTER DC/DC 1.8V 27W OUT
• Manufacturer: Lineage Power
• Series: JAHWr
• Type: Isolated with Remote On/Offr

Specifications of JAHW075Y1

• Output: 1.8V
• Number Of Outputs: 1
• Power (watts): 27W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 1.8 VDC @ 15A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 27W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 88%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

dc-dc Converters; 36 to 75 Vdc Input, 1.8 Vdc Output; 18 W to 36 W
Thermal Considerations
Heat Transfer Without Heat Sinks
Figure 28. JAHW075Y Power Dissipation vs.
Figure 29. JAHW100Y Power Dissipation vs.
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m (5 in.-lb.).
14
14
4.5
3.5
2.5
1.5
0.5
7
6
5
4
3
2
1
0
5
4
3
2
1
0
0
0
Output Current at 25 °C
Output Current at 25 °C
2
2
4
4
OUTPUT CURRENT, I
OUTPUT CURRENT, I
6
6
8
10
8
12
(continued)
10
O
O
14
(A)
(A)
V
V
V
12
I
I
I
= 75 V
= 48 V
= 36 V
16
(continued)
V
V
V
I
I
I
= 75 V
= 48 V
= 36 V
14
18 20
8- 3249 (C)
8-3248 (F)
16
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 25. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 30. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
Figure 30. Case-to-Ambient Thermal Resistance
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 30 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 30 is shown in the following example.
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the JAHW100Y
module is operating at V
of 20 A, maximum ambient air temperature of 65 °C,
and the heat sink is 1/4 inch.
θ
ca
9
8
7
6
5
4
3
2
1
0
0
=
Curves; Either Orientation
ΔT
-------------------- -
(100)
0.5
P
C max
,
D
AIR VELOCITY, m/s (ft./min.)
(200)
1.0
=
I
= 48 V and an output current
(
----------------------- -
T
(300)
D
C
1.5
):
P
–
D
C, max
T
A
NO HEAT SINK
1/4 IN. HEAT SINK
1/2 IN. HEAT SINK
1 IN. HEAT SINK
)
(400)
2.0
) divided by the
Lineage Power
April 2008
(500)
2.5
C
) is
8-3184 (F)
(600)
3.0