EPC9002 EPC, EPC9002 Datasheet - Page 4

• Manufacturer Part Number: EPC9002
• Description: BOARD DEV FOR EPC1001 100V GAN
• Manufacturer: EPC

Specifications of EPC9002

• Design Resources: EPC9002 Schematic EPC9002 Bill of Materials EPC9002 Gerber Files
• Main Purpose: Power Management, Half H-Bridge Driver (External FET)
• Utilized Ic / Part: EPC1001
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -
• Other names: 917-1011

DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2010 |
DIE MARKINGS
DIE OUTLINE
DIE OUTLINE
Bottom View
Bottom View
Side View
RECOMMENDED
LAND PATTERN
(measurements in µm)
(measurements in µm)
Die orientation dot
Gate Pad bump is
under this corner
1001
YYYY
ZZZZ
EPC1001
Number
Part
SEATING PLANE
Marking Line 1
Part #
1001
Laser Markings
Lot_Date Code
Marking line 2
Pad no. 1 is Gate;
Pads no. 3, 5, 7, 9, 11 are Drain;
Pads no. 4, 6, 8, 10 are Source;
Pad no. 2 is source and is recommended
to pin out as a source sense.
DIM
A
B
c
d
e
g
f
YYYY
4075
1602
1379
MIN
577
235
248
400
Lot_Date Code
Marking Line 3
MICROMETERS
Nominal
1.382
4105
1632
ZZZZ
580
250
250
400
change without notice.
Information subject to
Revised April, 2010
EPC1001
| PAGE 4
1.385
MAX
4135
1662
583
265
252
400