DAC101C08XEB National Semiconductor, DAC101C08XEB Datasheet - Page 3

• Manufacturer Part Number: DAC101C08XEB
• Description: BOARD EVALUATION FOR DAC101C08X
• Manufacturer: National Semiconductor

Specifications of DAC101C08XEB

• Number Of Dac's: 1
• Number Of Bits: 10
• Outputs And Type: 1, Single Ended
• Data Interface: Serial
• Settling Time: 4.5µs
• Dac Type: Voltage
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 125°C
• Utilized Ic / Part: DAC101C08X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

(LLP only)
Pin Descriptions
Package Pinouts
Symbol
MSOP-8
ADR0
ADR1
TSOT
V
GND
SDA
V
PAD
SCL
LLP
V
OUT
REF
A
Analog Output
Input/Output
Digital Input,
Digital Input,
Digital Input
V
three levels
three levels
OUT
1
6
8
Ground
Ground
Supply
Supply
Digital
Type
V
2
5
6
A
GND
3
4
5
Equivalent Circuit
SDA
4
3
4
3
SCL
5
2
3
Analog Output Voltage.
Power supply input. For the TSOT and LLP versions, this
supply is used as the reference. Must be decoupled to
GND.
Ground for all on-chip circuitry.
Serial Data bi-directional connection. Data is clocked into
or out of the internal 16-bit register relative to the clock
edges of SCL. This is an open drain data line that must be
pulled to the supply (V
Serial Clock Input. SCL is used together with SDA to
control the transfer of data in and out of the device.
Tri-state Address Selection Input. Sets the two Least
Significant Bits (A1 & A0) of the 7-bit slave address. (see
Table 1)
Tri-state Address Selection Input. Sets Bits A6 & A3 of the
7-bit slave address. (see Table 1)
Unbufferred reference voltage. For the MSOP-8, this
supply is used as the reference. V
and decoupled to GND.
Exposed die attach pad can be connected to ground or left
floating. Soldering the pad to the PCB offers optimal
thermal performance and enhances package self-
alignment during reflow.
ADR0
6
1
1
ADR1
N/A
N/A
2
Description
A
) by an external pull-up resistor.
V
N/A
N/A
REF
7
REF
must be free of noise
PAD (LLP only)
www.national.com
N/A
N/A
7