ATQT600 Atmel, ATQT600 Datasheet - Page 3

KIT EVAL TOUCH FOR QT600

ATQT600

Manufacturer Part Number
ATQT600
Description
KIT EVAL TOUCH FOR QT600
Manufacturer
Atmel
Series
QTouch™r
Datasheets

Specifications of ATQT600

Sensor Type
Touch Screen
Interface
USB
Embedded
Yes, Other
Utilized Ic / Part
ATtiny88, ATmega324PA, ATxmega128A1
Processor To Be Evaluated
ATtiny88, ATmega324, ATxmega128
Data Bus Width
8 bit, 16 bit
Interface Type
USB
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
1.6 V to 3.6 V
Silicon Manufacturer
Atmel
Kit Application Type
Sensor
Application Sub Type
Touch Sensor
Kit Contents
USB Bridge, MCU Cards, Touchpad Cards
Svhc
No SVHC (15-Dec-2010)
Mcu Supported Families
ATtiny88,
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATQT600
Manufacturer:
Atmel
Quantity:
135
Touch Sensors Design Guide
Table of Contents
Section 1
Introduction To Sensor Design................................................................................... 1-1
Section 2
General Advice........................................................................................................... 2-1
Section 3
Self-capacitance Zero-dimensional Sensors.............................................................. 3-1
1.1
1.2
1.3
1.4
2.1
2.2
2.3
2.4
2.5
3.1
3.2
3.3
Introduction ........................................................................................................................ 1-1
Self-capacitance and Mutual-capacitance Type Sensors .................................................. 1-1
Dimension Groups ............................................................................................................. 1-2
Some Important Theory ..................................................................................................... 1-2
Charge Transfer................................................................................................................. 2-1
Components....................................................................................................................... 2-3
Materials ............................................................................................................................ 2-4
Nearby LEDs...................................................................................................................... 2-7
Electrostatic Discharge Protection ..................................................................................... 2-8
Introduction ........................................................................................................................ 3-1
Planar Construction ........................................................................................................... 3-1
Non-planar Construction .................................................................................................... 3-7
2.2.1
2.2.2
2.2.3
2.2.4
2.3.1
2.3.2
2.3.3
2.3.4
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.3.1
Cs Capacitor ........................................................................................................ 2-3
Series Resistors................................................................................................... 2-3
Voltage Regulator ................................................................................................ 2-3
Component Placement ........................................................................................ 2-3
Substrates ........................................................................................................... 2-4
Electrode and Interconnection Materials ............................................................. 2-4
Front Panel Materials........................................................................................... 2-5
PCB to Panel Bonding ......................................................................................... 2-6
Introduction .......................................................................................................... 3-1
Electrode Shapes ................................................................................................ 3-2
Ground Loading ................................................................................................... 3-3
Interconnection .................................................................................................... 3-4
Illumination Effects............................................................................................... 3-5
Floating Conductive Items ................................................................................... 3-6
Conductive Paints................................................................................................ 3-7
Printed Electrode Method .................................................................................... 3-8
10620D–AT42–04/09
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