AD8331-EVAL Analog Devices Inc, AD8331-EVAL Datasheet - Page 54

BOARD EVAL FOR AD8331

AD8331-EVAL

Manufacturer Part Number
AD8331-EVAL
Description
BOARD EVAL FOR AD8331
Manufacturer
Analog Devices Inc
Datasheets

Specifications of AD8331-EVAL

Design Resources
Interfacing the High Frequency AD8331 to AD9215 (CN0096)
Module/board Type
Evaluation Board
For Use With/related Products
AD8331
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
AD8331/AD8332/AD8334
1.00
0.85
0.80
SEATING
PLANE
INDICATOR
1.00
0.85
0.80
12° MAX
PIN 1
12° MAX
SEATING
PLANE
PIN 1
INDICATOR
BSC SQ
9.00
BSC SQ
VIEW
TOP
VIEW
TOP
5.00
Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
0.50 BSC
0.80 MAX
0.65 TYP
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
BSC SQ
5 mm × 5 mm Body, Very Thin Quad
9 mm × 9 mm Body, Very Thin Quad
0.20 REF
Dimensions shown in millimeters
Dimensions shown in millimeters
4.75
BSC SQ
0.20 REF
8.75
Rev. G | Page 54 of 56
0.05 MAX
0.02 NOM
0.05 MAX
0.02 NOM
0.60 MAX
(CP-32-2)
(CP-64-1)
0.60 MAX
0.50
0.40
0.30
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.08
48
33
49
32
0.60 MAX
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
(BOTTOM VIEW)
EXPOSED PAD
EXPOSED
3.50 REF
PAD
7.50
REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
32
9
1
8
0.30
0.25
0.18
17
64
16
1
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
* 4.85
4.70 SQ
4.55
PIN 1
INDICATOR

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