JMK325BJ226MM-T Taiyo Yuden, JMK325BJ226MM-T Datasheet - Page 49

• Manufacturer Part Number: JMK325BJ226MM-T
• Description: CAP CER 22UF 6.3V X5R 1210
• Manufacturer: Taiyo Yuden
• Series: JMKr

Specifications of JMK325BJ226MM-T

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 1210 (3225 Metric)
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Thickness: 2.50mm
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 20%
• Voltage Rating: 6.3VDC
• Capacitor Case Style: 1210
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Other names: 587-1384-2; CE JMK325 BJ226MM-T; JMK325BJ226MM-T

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Precautions on the use of Multilayer Ceramic Capacitors
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
mlcc_prec_e-01
2. PCB Design
3. Mounting
Precautions
consider-
consider-
Technical
Technical
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
（1） Required adhesive characteristics
（2） The recommended amount of adhesives is as follows;
◆Pattern configurations （ Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
◆Adjustment of mounting machine
◆Selection of Adhesives
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
◆Selection of Adhesives
（1） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2） The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
［Recommended condition］
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
shall be considerable.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
f . The adhesive shall have corrosion resistance.
Deflection of board
flection.
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Figure
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Double-sided
Single-sided
b
a
c
mounting
mounting
Items
Items
212/316 case sizes as examples
Adhesives shall not contact land
100 to 120 μm
0.3mm min
Not recommended
Not recommended
Recommended
Recommended
1 1
mlcc_prec-P2