MPXV6115V FREESCALE [Freescale Semiconductor, Inc], MPXV6115V Datasheet
MPXV6115V
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MPXV6115V Summary of contents
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... On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV6115V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer ...
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... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV6115V 2 = 5.0 Vdc 25° ...
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... Gain Stage #2 Thin Film And Temperature Ground Compensation And Reference Gain Stage #1 Shift Circuitry Pins 4, 5, and 6 are no connects 3 GND Pressure Value Units 400 kPa °C -40 to +125 °C -40 to +125 0.5 mAdc -0.5 mAdc the application circuit. out out MPXV6115V 3 ...
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... A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV6115V series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability ...
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... Transfer Function (MPXV6115V) V Nominal Transfer Value: Temperature Error Band 4.0 3.0 2.0 1.0 0.0 -40 NOTE: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band 1.950 1.725 1.500 0 -1.500 -1.725 -1.950 Sensors Freescale Semiconductor = V x (0.007652 0.92) out S ± ...
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... With the correct pad geometry, the packages will self-align when subjected to a 0.060 TYP 8X 1.52 MPXV6115V 6 SURFACE MOUNTING INFORMATION solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts ...
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... ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE MPXV6115V 7 ...
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... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXV6115V Rev. 0 11/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...