SMLVT3V3 STMicroelectronics, SMLVT3V3 Datasheet - Page 5

• Manufacturer Part Number: SMLVT3V3
• Description: DIODE TRANSIL LOW VOLT SMB
• Manufacturer: STMicroelectronics
• Series: TRANSIL™r

Specifications of SMLVT3V3

• Voltage - Reverse Standoff (typ): 3.3V
• Voltage - Breakdown: 4.1V
• Power (watts): 600W
• Polarization: Unidirectional
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Polarity: Unidirectional
• Channels: 1 Channel
• Clamping Voltage: 10.3 V
• Operating Voltage: 3.3 V
• Breakdown Voltage: 64.4 V
• Termination Style: SMD/SMT
• Peak Surge Current: 40 A
• Peak Pulse Power Dissipation: 600 W
• Capacitance: 5200 pF
• Maximum Operating Temperature: + 175 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 3.95 (Max) mm W x 4.6 (Max) mm L
• Capacitance, Junction: 5200 pF
• Current, Reverse: 1 mA
• Current, Surge: 100 A
• Package Type: DO-214AA (SMB)
• Power Dissipation: 600 W
• Primary Type: Module
• Speed, Switching: Fast
• Temperature, Junction, Maximum: +175 °C
• Voltage, Reverse: 3.3 V
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 4.1V
• Reverse Stand-off Voltage: 3.3V
• Leakage Current (max): 200uA
• Peak Pulse Current: 200A
• Test Current (it): 1mA
• Operating Temp Range: -65C to 175C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2496-2

Package information
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Package information
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Table 3.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 8.
C
1.62
Case: JEDEC DO-214AA molded plastic over Planar junction
Epoxy is rated UL94V-0
RoHS compliant package
2.60
5.84
Footprint dimensions
(millimeter)
SMB Dimensions
E1
E
1.62
L
D
2.18
A2
A1
Figure 9.
b
x x x
z
Cathode bar ( unidirectional devices only )
y w w
Marking layout
Ref.
A1
A2
E1
E
D
b
L
c
e3
Min.
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
Millimeters
E : ECOPACK ( Leadfree ) mention
XXX : Marking
Z : Manufacturing location
Y : Year
WW : week
Max.
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
Dimensions
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
Min.
SMLVT3V3
Inches
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
Max.